Google Inc.

Apple Inc.

Gopro, Inc.

Ihab A Ali

Arun Prakash Raghupathy

Emil Rahim

Duen Hsing Hsieh

Frédéric Heckmann

Nicholas D Woodman

James Robert Lim

Todd Gotham

Chang Hong Ye

Jacobi Colton Grillo

Frank Faqiu Liang

Chintan Trehan

Phanindraja Ancha

David Wang

Reza Yazdani

Neha Ravi Dixit

Wilson Tang

Truong Ho Cong

Dinesh C Mathew

David T Wang

Chris A Ligtenberg

Keith J Hendren

Ron Alan Hopkinson

Christiaan A Ligtenberg

Thomas W Wilson, Jr

Timothy Macmillan

Mark Kraz

Gavin J Reid

Jay S Nigen

David A Hardell

Kok Yen Cheng

Eric Monsef

Chi-Ming Lin

Gerald McGinty

Bernard K Rihn

Zach Zeliff

Mark Benjamin Kraz

A battery pack includes a battery, a first temperature sensor configured to provide a first temperature value associated with a temperature of the battery, a heat source disposed proximate to the battery and configured to heat the battery, a second temperature sensor configured to provide a second temperature value associated with a temperature of the heat source, and a control board coupled to the first temperature sensor and the second temperature sensor, wherein the control board is configured to receive the first temperature value and the second temperature value. The control board is configured to compare the first temperature value and the second temperature value to determine a temperature gradient between the battery and the heat source and transmit an alert if the temperature gradient exceeds a first temperature gradient threshold.

Thermal gradient battery monitoring system and methods

The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includes monitoring several thermal zones to determine or estimate thermal conditions in corresponding parts of the electronic speaker device. The thermal zones may include a System-on-Chip (SoC) integrated circuit (IC) component, audio components including power-dissipating IC components, and a temperature of an exterior surface of a housing component of the electronic speaker device. To mitigate thermal runaway, different throttling schemes may be triggered based on the thermal zones exceeding certain thermal limits. The throttling schemes may include reducing the amount of power supplied to the SoC, reducing audio power of the audio components to a lower wattage, or manipulating SoC cores such as by disabling one or more of the cores or adjusting utilization of the SoC cores.

Thermal mitigation for an electronic speaker device and associated apparatuses and methods

This document describes techniques directed to active thermal-control of a floodlight and associated floodlights. As described, an example floodlight includes a first heat-transfer subsystem that uses a fully enclosed heat sink to transfer heat from an array of LEDs to a first housing component of the floodlight. The floodlight further includes a second heat-transfer subsystem to transfer heat from one or more PSUs to a second housing component of the floodlight. Described techniques include using thermistors located throughout the floodlight to actively monitor a temperature profile within the floodlight and, if one or more operating-temperature thresholds are violated, reducing power consumption within the floodlight.

Active thermal-control of a floodlight and associated floodlights

This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

Passive thermal-control system of an electronic speaker device and associated electronic speaker devices

The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device. The housing of the electronic speaker device may dissipate the heat to the ambient environment to prevent thermal runaway of the electronic subsystems, and the internal frame mitigates the temperature of the housing from exceeding ergonomic temperature limits.

Passive thermal-control structure for speakers and associated apparatuses and methods

This document describes a thermal-control system that may be integrated into a mesh network device and associated mesh network devices. The thermal-control system, which may include a heat sink, multiple heat spreaders, and a heat shield, is such that heat originating from IC devices populating a printed circuit board of the mesh network device may be transferred to a housing component of the mesh network device for external dissipation to maintain a desired thermal profile of the mesh network device.

Thermal-control system of a mesh network device and associated mesh network devices

This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

Thermal-control system of a media-streaming device and associated media-streaming devices

This document describes a thermal-control system that is integrated into a security camera. The thermal-control system includes a combination of heatsinks and thermal interface materials with high thermal conductivities. The thermal-control system may transfer and spread energy from a high thermal-loading condition effectuated upon the security camera to concurrently maintain temperatures of multiple thermal zones on or within the security camera at or below prescribed temperature thresholds.

Thermal-control system for a security camera and associated security camera

This document describes a thermal-control system that is integrated into a video-recording doorbell. The thermal-control system includes a combination of heat spreaders and materials with high thermal conductivity. The thermal-control system may spread and dissipate energy from a thermal-loading condition effectuated upon the video-recording doorbell to concurrently maintain temperatures of multiple thermal zones on or within the video-recording doorbell at or below prescribed temperature thresholds.

Thermal-control system of a video-recording doorbell and associated video-recording doorbells

An image capture device includes an image sensor and a heat controller. The image capture device includes a heat spreader that extends between the image sensor and the heat controller. The heat spreader dissipates heat from the image sensor to the heat controller. The image capture device includes an electronics unit spaced from the image sensor. The image capture device includes a compressive insulator that contacts the heat spreader and the electronics unit, and the compressible insulator thermally separates the electronics unit and the heat spreader.

Heat spreader for camera

This document describes a passive thermal-control system that is integrated into a mesh network device. The passive thermal-control system, which may include a heat sink and multiple heat spreaders, is such that heat originating with integrated circuit devices of the mesh network device and a speaker module of the mesh network device may be transferred to other components of the mesh network device, such as a housing component of the mesh network device. The heat may then be dissipated to an external environment to maintain a desired thermal profile of the mesh network device.

Passive thermal-control system of a mesh network device and associated mesh network devices

This document describes a reinforced graphite heat-spreader for a surface of a housing component of an electronic device. The reinforced graphite heat-spreader includes a heat-spreader material stack having a layer of graphite material to spread heat. The reinforced graphite heat-spreader also includes an interface material stack that joins the heat-spreader material stack to the housing surface of an electronic device. The interface material stack, which may be formed using embossing techniques, includes protuberances that may be formed from an adhesive material.

Reinforced graphite heat-spreader for a housing surface of an electronic device

Growing community of inventors

Cupertino, CA, United States of America

Ihab A Ali