United Technologies Corporation

Igor V Belousov

Anatoly Kuzmichev

Yuriy G Kononenko

Robert L Memmen

Igor S Malashenko

John F Mullooly, Jr

David A Rutz

Monika D Kinstler

Richard S Mullin

Oleg G Pankov

Vadim Ivanovich Bondarchuk

Gregory A Serhiyenko

Evgeniy A Shelkovoy, Legal Representative

Michael J Maloney

Dmitriy Ryzhikov

Carl R Soderberg

Andrii Marynskyi

Igor V Gulyayev

Vladimir Biber

Leonid Shaginyan

Anatoli N Shelkovoy

Alexander V Makhotkin

Anatoly I Kuzmichev

Jr John F Mullooly

Jr John E Mullooly

A method to limit surface zone recrystallization in a superalloy article includes limiting recrystallization in a surface zone of a superalloy article by treating the superalloy article in an oxygen-containing environment to introduce oxygen into the surface zone in an amount sufficient to pin any new grain boundaries in the surface zone.

Method for limiting surface recrystallization

An apparatus for depositing a coating on one or more parts () has: a chamber (); a part holder () for carrying the part(s); a bias voltage source () coupled to the part(s) to apply a bias voltage to the part(s); a source () of the coating material; a plurality of temperature sensors (); and a plurality of leads () passing outputs of the temperature sensors out from the chamber. A temperature monitoring system () has a temperature data processor (). At least one fiber optic link () couples the temperature data processor to the temperature sensors so as to electrically isolate the temperature data processor from the bias voltage.

Deposition substrate temperature and monitoring

A coated part is exposed to a gas flow. The gas flow has a characteristic gas flow direction distribution over a surface of the coated part. The coated part has a substrate having a substrate surface and a coating over the substrate surface. The coating comprises at least one coating layer. A first such layer is columnar and has a column boundary direction distribution. The column boundary direction distribution is selected for partial local alignment with the gas flow direction distribution.

Thermal barrier coatings and methods of application

A ceramic material is applied to a part. The part is placed in a deposition chamber and a first electric potential is applied to the part. Components are evaporated for forming the material. The evaporated components are ionized. The first electric potential is modulated so as to draw the ionized component to the part. The modulation comprises maintaining at least an ion current density in a range of 2-1000 mA/cm.

Ceramic coating deposition

A pressure lock system passes a wire along a wire path from a wire source at a high pressure first region to a destination at a low pressure second region. The pressure lock system includes a pressure lock chamber. A first conduit has an interior positioned to pass the wire along the path and is mounted for rotation. A second conduit has an interior positioned to pass the wire from the pressure lock chamber and is also mounted for rotation. A motor may drive rotation of the first conduit and the second conduit. Pumps may maintain a pressure of the pressure lock chamber lower than a pressure of the first region.

Wire feed pressure lock system

Ion-enhanced physical vapor deposition is augmented by sputtering to deposit multi-component materials. The process may be used to deposit coatings and repair material on Ti alloy turbine engine parts. The physical vapor deposition may be ion-enhanced electron beam physical vapor deposition.

Multi-component deposition

A material is applied to a part. The part is placed in a deposition chamber and a first electric potential is applied to the part. Components are evaporated for forming the material. The evaporated components are ionized. The first electric potential is modulated so as to draw the ionized component to the part. The modulation comprises a plurality of first steps for PA-PVD. Each of the first steps comprises a series of pulses of negative potential. The modulation further comprises a plurality of second steps for PVD alternating with the first steps.

A method for depositing a first material on a substrate includes providing the substrate in a deposition chamber. A molten body is formed between the substrate and a source of the first material by melting one or more second materials. A flow of the first material is passed through the molten body and from the molten body to the substrate as a vapor flow. An essentially non-expending portion of the molten body comprises an alloy having a melting temperature below a melting temperature of the first material.

Vapor deposition of dissimilar materials

Ion-enhanced physical vapor deposition is utilized to deposit repair material on Ti alloy turbine parts. Pulse modulation may be used to control a bias voltage and an ionization.

Repairing turbine element

Physical vapor deposition is augmented by chemical vapor deposition from one or more organometallic compounds to deposit multi-component materials. The organometallic compounds may be carbonyls. The process may be used to deposit coatings and repair material on superalloy turbine engine parts.

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Kyiv, Ukraine

Igor V Belousov