Microsoft Technology Licensing, LLC

Applied Materials, Inc.

Igor Markovsky

Michael Nikkhoo

Brian Joseph Toleno

Kartik Ramaswamy

Kenneth S Collins

James D Carducci

Shahid Rauf

Leonid Dorf

Zhigang Chen

Zheng John Ye

Nipun Misra

Erin Elizabeth Hurbi

Tzu-Yuan Lin

Ravi Kiran Nalla

Andriy Pletenetskyy

Shahar Ben-Menahem

Michael Beerman

Simon Hodgson

Marianne E Laford

Marianne Elizabeth La Ford

Vijay Boovaragavan

Brian J Toleno

Michael Neil Beerman

The disclosure pertains to a capacitively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a symmetrical power distribution.

Symmetric VHF source for a plasma reactor

Disclosed is a fit system for improving users' comfort with wearable articles, such as head-worn articles. The fit system includes a lattice of collapsible beams that can be constructed of elastomer foam located at the interface between the wearable article and a part of the user's body. The collapsible beam construction provides a non-linear relationship between the amount of force or pressure applied on the body part and the amount of compression of the foam.

Fit system using collapsible beams for wearable articles

A pad shape for a support assembly is optimized to provide universal fitting characteristics to Head-Mounted Display (HMD) devices. The pad shape enables a display of a single HMD device to be reliably aligned within multiple users' fields-of-view notwithstanding significant variations of shape and size between these users' heads. Optimal positioning of the display within the multiple users' fields-of-view may be achieved by positionally constraining the HMD device against a portion of the head that varies relatively slightly as compared to other portions of the head. The contact pad includes a curved region having a shape defined by a high order polynomial that corresponds to an empirically determined best fit surface. Empirically determining one or both of the best fit surface or the high order polynomial may include aligning a plurality of 'forehead' point clouds that map the geometries of a sample set of users' foreheads.

Support assembly pad shape for providing universal fitting head-mounted display devices

A Near-Eye-Display (NED) device having a housing shell that is integrated with molded boss clusters for precision mounting of hardware components. The techniques disclosed herein include forming a housing shell directly over one or more pre-molded boss clusters that have been inserted into cavities of a housing shell mold core. For example, with the pre-molded boss clusters already inserted into the cavities, a selected housing shell material such as a thermosetting epoxy resin impregnated carbon fiber reinforced (CFRP) fabric may be thermal compression molded over the housing shell mold core. Individual ones of the pre-molded boss clusters include one or more 'three-dimensional (3D)' bosses for mounting various hardware components of the NED device. The bosses may protrude from an inner surface of the housing shell and may provide interior mounting features without affecting the appearance of the outer surface of the housing shell.

Near eye display (NED) device housing shell integrated with molded boss clusters for precision mounting of hardware components

A head-up display system comprises a microprojector, first and second viewer optics, a redirection optic, and an electronic controller. Switchable electronically between first and second optical states, the redirection optic is configured to receive a display image from the microprojector, to convey the display image, in the first optical state, to the first viewer optic, and to convey the display image, in the second optical state, to the second viewer optic. The electronic controller is configured to, during a first interval, switch and maintain the redirection optic in the first optical state and cause the microprojector to form the display image based on first image data. The electronic controller is further configured to, during a second interval, switch and maintain the redirection optic in the second optical state and cause the microprojector to form the display image based on second image data.

Head-up multiplex display with redirection optic

A printed circuit board (PCB) incorporates at least one damping layer or section. The at least one damping layer is incorporated in the PCB to absorb vibrations or oscillations that may be conveyed to the PCB. Such vibrations or oscillations may be generated by one or more electrical components coupled to the PCB. The damping layer is disposed to prevent the PCB from audibly vibrating when the electrical components associated with the PCB are caused to vibrate or pulsate under a voltage load.

Audible signal attenuating printed circuit board

A perspiration dissipating support assembly for head-mounted-display (HMD) devices. Variations of the perspiration dissipating support assembly disclosed herein enable supporting forces for an HMD device to be spread over a large portion of a user's head while facilitating dissipation of both liquid perspiration and vapor perspiration via respective dedicated dissipation mechanisms. In some embodiments, the perspiration dissipating support assembly includes a vapor-permeable contact layer that contacts the user's head and a vapor-permeable spacer that provides a Moisture Vapor Transmission Rate on the order of several times greater than that of the vapor-permeable contact layer. The vapor-permeable contact layer may have wicking properties that tend to draw perspiration (e.g., via capillary action resulting from a particular technical-weave pattern) away from the user's head and into the vapor-permeable spacer through which the perspiration evaporates into the ambient environment. The vapor-permeable spacer may be a three-dimensional fabric and/or an open-cell foam.

Perspiration dissipating support assembly for head-mounted display devices

Devices with components mounted to a surface interior often encounter problems with generated heat, which is difficult to dissipate from a tightly packed and sealed device interior. Excessive heat may also distort the surface substrate material, which may become brittle from accumulated thermal stress and/or warp in a manner that displaces the position and/or orientation of the components. Presented herein are device manufacturing techniques in view of temperature considerations. Devices may comprise a device housing of a housing material that exhibits a substantially isotropic coefficient of thermal expansion (CTE) and/or thermal conductivity in various dimensions. Devices may also comprise a housing mount for a component cluster that is mountable on the interior surface of the device housing, with electrically conductive traces integrated with the device housing that conductively interconnect the housing mount with the component cluster, optionally generated via laser-activation of a conductive additives or deposition of conductive material.

Devices with mounted components

An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.

Head mounted computing device, adhesive joint system and method

The examples disclosed herein are related to graphene-based materials on see-through optical displays. One example provides, a computing device, including a see-through display system including an optical component through which a surrounding environment is viewable, an electrical component disposed on a user-facing side of the optical component, and a graphene-based layer disposed on the optical component, the graphene-based layer comprising a greater thickness of a graphene-based material on a portion closer to the electrical component and a lesser thickness of a graphene-based material on a portion farther from the electrical component.

Graphene in optical systems

An electronic device can include a circuit board, an electronic component mounted on the circuit board, a conductive contact disposed (e.g., deposited) on the circuit board, and a shielding polymer layer deposited over the electronic component. The shielding polymer layer includes a network of conductive pathways formed from sintered particles. The network of conductive pathways is electrically coupled to the conductive contact, which can be configured for connection to a power source ground. As such, the network of conductive pathways enables electromagnetic shielding of the electronic component.

Polymeric electromagnetic shield for electronic components

The techniques disclosed herein provide an enhanced mount for a camera module. The mount comprises at least a first side and a second side. The sides are formed to enable contact with at least a portion of the camera module. The sides are configured with openings to enable a fastening material, such as an adhesive, to secure the camera module to the mount. Openings within the mount enable the use of a fastening material to secure the camera module to at least one surface of the mount while allowing the camera module and at least one surface to maintain the mechanical contact. In some configurations, one or more openings are formed such that a contraction of the fastening material pulls the camera module toward at least one surface of the mount.

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San Jose, CA, United States of America

Igor Markovsky