Mellanox Technologies, Ltd.

Igor Loiferman

Samer Khoury

Avi Gibbs

Shy Zimmerman

Ofer Levy

Alex Kremenetsky

Rom Becker

Adi Berman

Avi Gibbis

Tomer Klein

A device may include a printed circuit board (PCB), a plurality of surface-mount devices disposed on the PCB, wherein a thermal mass of each of the surface-mount devices ranges between a first thermal mass value and a second thermal mass value that is greater than the first thermal mass value, and a plurality of thermal capacitors disposed on the PCB, wherein a thermal mass of each of the thermal capacitors is equal to or greater than the first thermal mass value of the surface-mount devices.

Electronic assembly and method for thermal balancing of surfacemount devices

A cable pillar is provided for use in a switch system. The cable pillar includes a cavity that enables a plurality of cables to pass from a first side to a second side of the cable pillar. For example, the cables may be routed from sets of access paths located in rails mounted on the sides of the cable pillar to enlarged access paths located near the top or bottom of the cable pillar. The enlarged access paths may be sized to receive every cable that passes through a set of access paths located on an opposing side of the cable pillar from a corresponding enlarged access path. Additionally, the cable pillar may be configured to releasably attach to a chassis of the switch system. In some examples, the plurality of cables accommodated by the cable pillar may serve as a cable backplane of the switch system.

Cable pillar for director switch systems

A spine switch for a network switch comprises a support board that supports at least one first switch. The spine switch further includes a first set of connectors at a first edge of the support board that detachably connect to one or more first leaf switches to communicatively couple and decouple the at least one first switch from the one or more first leaf switches.

Systems, methods, and devices for replaceable elements within network switches

An electronic module includes, a circuit board having front and rear edges, and first and second connectors. The rear edge includes, (i) a first section at a first distance from the front edge, and (ii) a second section at a second distance from the front edge, different from the first distance. The first and second connectors are mounted along the rear edge at the first and second sections, respectively, and are configured to connect the circuit board to an interconnect unit.

Graded midplane

A main unit of a director-class switch including a wire-based backplane located in a chassis, having a plurality of slots configured to receive switch boards. The wire-based backplane includes a plurality of harnesses each including first and second cartridges, a plurality of interface port units mounted on each of the first and second cartridges and cables connecting each of the interface port units of the first cartridge to each of the interface port units of the second cartridge. The harnesses are mounted in the chassis such that the interface port units face ends of the slots in a manner configured to mate with corresponding connectors of switch boards inserted into the slots. A plurality of interface port units are mounted in each slot. Each cartridge includes interface port units which are located in a plurality of different slots.

Growing community of inventors

Yokneam Illit, Israel

Igor Loiferman