Ipg Photonics Corporation

Igor Berishev

Alexey Komissarov

Nikolai Strougov

Vadim Chuyanov

Pavel Trubenko

Alex Ovtchinnikov

Alexander Ovtchinnikov

Dmitriy Miftakhutdinov

Svletan Todorov

A multi-layer laser diode mount is configured with a submount made from thermo- and electro-conductive material. One of the opposite surfaces of the submount supports a laser diode. The other surface of the submount faces and is spaced from a heatsink. The submount and heatsink are configured with respective thermal expansion coefficients ('TEC') which are different from one another. The opposite surfaces of the submount are electroplated with respective metal layers one of which is bonded to a soft solder layer. In one aspect of the disclosure, the mount is further configured with a spacer having the same TEC as that of the submount and bonded to the soft solder layer. A layer of hard solder bonds the spacer and heatsink to one another. In a further aspect of the disclosure, the electroplated metal layer in contact with the other surface of the submount is hundred- or more micron thick. The soft solder is directly bonded to the heatsink. In both aspects of the disclosure, a temperature of a p-n junction of the laser diode remains substantially constant within a 0 to 2&#xb0; C. temperature range through a predetermined amount of several hundred of repeated thermo-cycles which is indicative of uncompromised integrity of the soft solder.

High-power laser diode packaging method and laser diode module

A method for manufacturing submounts for laser diodes includes the steps of providing a base configured with a ceramic carrier and a metal layer deposited upon the substrate. The method further includes using a pulsed laser operative to generate a plurality of pulses which are selectively trained at predetermined pattern on the metal layer's surface so as to ablate the desired regions of the metal layer to the desired depth. Thereafter the base is divided into a plurality of submounts each supporting a laser diode. The metal layer includes a silver sub-layer deposited upon the ceramic and having a thickness sufficient to effectively facilitate heat dissipation.

Laser ablation process for manufacturing submounts for laser diode and laser diode units

An improved high power spatial filter, system and method. In the system, an optical fiber is disposed inside a ferrule channel structure, and the channel structure is aligned with a focusing lens system. The end of the fiber is at a distance D from the channel opening that faces the focusing lens system, and D is determined by the system's numeric aperture factor and the cladding thickness of the optical fiber.

High power spatial filter

A powerful high-brightness laser pump modules is configured with a plurality of spaced laser diodes each generating a light beam at a pump wavelength, and respective groups of optical components guiding the light beams along parallel light paths. The groups of the optical components each include a lens assembly and a bending mirror configured to couple the beam light into an output fiber which is common to all groups of the optical component. At least one optical component of each group is provided with a dielectric layer capable of preventing propagation of a backreflected light toward laser diodes at a wavelength different from the pump wavelength.

Growing community of inventors

Holden, MA, United States of America

Igor Berishev