Methode Electronics, Incorporated

Other

Radiation Detection Company

Iggoni Fajardo

Jeffrey Lee Allen

Ryan Kimura

Scott Herbert

Michael Chy Chao

Stephen Hatch

James Farquhar

Brandt Weibezhan

Robert N Golden

Barrie Laing

Roland Fielder Hanson

Manfred Schmed

Michael Laurance Smith

George Kyi

Ronald Orvis Smith

A release mechanism for releasing a transceiver module from a cage includes a fixed component, a locking component, and a pull component, where the locking component is used for locking the transceiver module in the cage and pivotally connected to the transceiver module. The user pulls the pull component to make the locking component to rotate to unlock and then draw out the transceiver module. The locking component further includes a spring part against the fixed component to resist the rotation and assist the locking component back to the original position. According to the fewer components and the easy assembly of the release mechanism, the total assembly cost of the transceiver module can be reduced significantly.

Release mechanism and transceiver module using the same

A device for performing thermoluminescent dosimetry and a method for making the same is disclosed. A thermoluminescent dosimetry device in accordance with the invention comprises a chip holder for holding thermoluminescent chips in free-space, such that the thermoluminescent chips are capable of being directly addressed after exposure to radiation. The chips are preferably suspended in free-space through support structures which minimize the contact with the thermoluminescent chips. A radiation detection device is preferably fabricated by placing the chip holder and a filter in a cup and thermally scaling a lid to edges of the cup.

Radiation detection device, method and system

A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.

Shielded PC card packages

Method of assembling a peripheral device printed circuit board package

A shield for a PCB package for shielding electromagnetic radiation from exiting or entering the package. Typically, the package includes first and second electrically conductive covers and first and second frames. A printed circuit board fits within the shield, and the shield fits within the first and second covers and frames. The shield has side walls which surround a perimeter of the printed circuit board so as to prevent electromagnetic radiation from entering and exiting through the first and second frames of the package. The shield also has ground springs which electrically connect the shield with the first and second covers so as to insulate the printed circuit board from electromagnetic radiation radiating to and from directions perpendicular to planes of the first and second covers. The shield also includes side springs which attached to the side walls and press against a side edge of one of the first and second frames so as to secure the shield within the package. Optionally, the shield can include ground clips attached to the side walls which contact the printed circuit board so as to electrically connect the printed circuit board to the shield. A further option is to provide a removed portion in one of the side walls so as to enable a connector of an input/output device to pass through the side wall of the shield.

RF and EMI shield

Growing community of inventors

Fremont, CA, United States of America

Iggoni Fajardo