Finisar Corporation

Idan Mizrahi

T H Ola Sjolund

Wei Shi

Jiashu Chen

Stephen John Macica

Steve Macica

In one example embodiment, an optoelectronic assembly includes an electronic substrate, a transparent component coupled on a first side of the electronic substrate, and a first component coupled to a second side of the electronic substrate opposite the first side. The electronic substrate, the transparent component, and the first component may define a hermetically sealed enclosure. A laser array or a receiver array may be mechanically coupled to the transparent component inside of the enclosure and oriented to transmit or receive optical signals through the transparent component. The laser array or the receiver array may be electrically coupled to the electronic substrate. A second component may be positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second component and the transparent component.

Thermally interfacing chip on glass assembly

A guide pin wafer may include a base wafer that includes multiple dies. Each die may include a corresponding lens cutout. The guide pin wafer may also include multiple guide pins mounted on the base wafer. Each die of the base wafer may be mounted with two or more corresponding guide pins that may be configured to engage a parallel fiber connector to the corresponding die.

Wafer assembly including a guide pin wafer

A TOSA can include: a light emitting element; and one or more heating elements thermally coupled to the light emitting element so as to provide a substantially constant heat generation profile and/or temperature profile across the TOSA during a light emitting element dormant period and a light emitting element firing period. The TOSA can include a controller operably coupled with the one or more heating elements so as to control the substantially constant heat generation profile and/or temperature profile. In one aspect, the one or more heating elements can include one or more dedicated heating elements. In one aspect, the one or more of the dedicated heating elements can include a resistor element or coil.

Heat-swap device and method

Aspects of the present disclosure include an optoelectronic assembly with a housing that defines a cavity and includes a first component and a glass component disposed on an opposite side of the cavity from the first component. The glass component may include a first surface and a second surface and a lens located on the first surface. An optical transmitter and/or an optical receiver may be mechanically coupled to the first component within the cavity and oriented to emit optical signals through the glass component and the lens. Conductive traces may be located on the second surface of the glass component and electrically coupled to the optical transmitter and/or the optical receiver. An electronic component may be coupled to at least one of the conductive traces.

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Fremont, CA, United States of America

Idan Mizrahi