Sumitomo Metal (Smi) Electronics Devices, Inc.

Ichirou Muraki

Akiyoshi Osakada

Kouichi Nakasu

A package for high frequency usageshas a notched areaon each longitudinal end of a substantially rectangular heat sink platefor fastening the package to a basewith a screw. The package includes a joined memberformed by joining a surface of a ring-like frame membermade of a ceramic material to the longitudinal center of a surface of heat sink plateand joining another surface to an external connection terminal. The other surface of heat sink platepresents a curved protruding shapebowing from its longitudinal ends toward its longitudinal center, so that curved protruding shapecauses at least an area of the other surface heat sink platethat corresponds to an area dedicated for mounting a semiconductor devicewithin ring-like frame memberto make a close contact with basewhen the package is fastened to baseby the screw at notched areas

Growing community of inventors

Mine, Japan

Ichirou Muraki