Sharp Kabushiki Kaisha Corporation

Ichiro Umekawa

Ryuzo Yuki

Takeshi Ishida

Shugo Yagi

Masaki Kageyama

Hirofumi Oosawa

Motoji Shiota

Yukio Shimizu

Gen Nagaoka

Yasuhiro Hida

An illumination device () is provided with the following: light sources (); a light-guide member (()) that includes a light entry region (Is) and a light exit region (Os) which emits planar light; light entry portions () that are formed in the light entry region (Is) and that oppose the light sources (); and bright line suppression portions () that are formed in the areas between the light entry portions () at the front side of the light entry region (Is), and that include bright line suppression prisms () which have a shape that changes the angle of the light emitted in a direction spreading out from the light sources () to a direction closer to the optical axes.

Illumination device and display device

Provided are an illumination device capable of improving the uniformity in brightness of the illumination light, and a display device using the same. An illumination device is provided with: a plurality of light sources arranged in a row in one direction; and a light guide plate which has, along a side edge face, a light receiving face facing the light source, guides light entering through the light receiving face, and outputs illumination light from a light emitting surface disposed on the front surface; the light guide plate having a plurality of prisms and a plurality of prisms provided in an indented manner on the front or rear surface and arranged in a row along the longitudinal direction of the light receiving face; the prisms being formed spanning between the light receiving face and the opposing face opposite the light receiving face; and the prisms being formed, between adjacent prisms, deeper than the prisms within a predetermined range in the vicinity of the light receiving face.

A liquid crystal display device () includes a glass substrate () having an LSI chip () and an FPC board () mounted thereon. A component ACF () made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors () on the glass substrate (). The component ACF () has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip () and the FPC board () which are mounted first. By thus using the large component ACF (), a positional constraint upon adhering the component ACF () to the glass substrate () is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.

Board module and method of manufacturing same

An LED () is attached to an active matrix substrate (), and a light emitting surface (L) of the LED () is positioned on an outer substrate surface (T) side of the active matrix substrate ().

Growing community of inventors

Osaka, Japan

Ichiro Umekawa