Sumitomo Electric Industries, Limited

Sumitomo Electric Indsutries, Ltd.

Ichiro Tonai

Toshio Mizue

Shunsuke Sato

Yoshiki Kuhara

Yasushi Fujimura

Osamu Akita

Takeshi Irie

Hiromi Kurashima

Nobuo Shiga

Takeshi Sekiguchi

Kazushige Oki

Sosaku Sawada

Hisato Michikoshi

Daisuke Takagi

Ryoji Sakamoto

Takeshi Himoto

Hisato Takahashi

Hiroshi Okuda

Ken-ichi Kitayama

Kazunori Kurima

Yasuki Mikamura

Hideaki Koseki

An optical module is inserted into a cage containing a connector electrically connected to a conductive wiring on a host board. The cage, the connector and the conductive wiring is provided on the host board. The optical module includes a circuit board and a housing. The circuit board has a card edge connector at an edge thereof. The card edge connector mates with the connector on the host board. The housing has a conductive ceiling with a rear edge and builds the circuit board therein. The conductive ceiling has a stopper supported thereby and protrudes therefrom. The stopper extrudes from the edge of the circuit board and the rear edge of the conductive ceiling.

Optical module and optical hub system

An optical part, which is used to be placed at an end face of an optical fiber, is constituted by a single light-transmitting material transparent to light transmitted through the optical fiber, and comprises an optical fiber contacting facedisposed in contact with the end face of the optical fiber, and an light emitting facetilted with respect to a cross section perpendicular to the axis of the optical fiber. Since the light emitting faceis formed with an inclination, such an optical partrestrains reflected light occurring at the optical fiber end face from going back to the optical fiber. Also, since the optical partis constituted by a single light-transmitting material, its configuration is simple, and the length can be shortened in the optical axis direction.

Optical part, optical module sleeve, optical receiving module, optical communication module, and method of making optical part

An optical connection sleevefor optically connecting an optical fiberand an optical deviceis constituted by a resin sleeveincluding an end portionin which a ferruleis inserted and a metal sleeveincluding an end portionon which the optical deviceis disposed, the metal sleevebeing insert-molded in the resin sleeveto be fixed thereto. With such a constitution, occurrence of positional deviation between the sleeveand an optical device unitis prevented, and the optical fiberand the optical devicecan be optically connected surely. Furthermore, it is prevented that the sleeve portion extending cylindrically functions as an antenna for electromagnetic noises. Accordingly, the optical connection sleeve in which the optical fiber and an optical component as the optical device are optically connected with high accuracy, and influences of the electromagnetic noises are fully reduced, an optical module and an optical communication module using the optical connection sleeve are realized.

Optical connection sleeve, optical module and optical communication module

A resin sleeve is used as an optical connection sleevefor optically connecting an optical fiberwith an optical component. A ferrule fixing surfaceprovided on an inner peripheral surface of a ferrule insertion portionof the sleeveis formed to have a multifaceted shape in which a cross section thereof on a plane vertical to an optical axis A thereof has a hexagonal shape. A ferrulecan be positioned and fixed accurately by a tight fit utilizing elastic deformation of resin. An outer peripheral surface of the ferruleand the ferrule fixing surfacecome into line contact with each other, and thus detachability of the ferruleis enhanced. Therefore, an optical fiber ferrule can be held accurately, and the optical connection sleeve having a satisfactory detachability, an optical module using the same and an optical communication module are realized.

The present invention relates to an optical module or the like having a structure which prevents the efficiency in a sleeve securing operation or optical characteristics from deteriorating and improves adhesion durability. In particular, a resin mold portion including an optical device in the optical module according to the present invention is processed into a shape which can directly irradiate the UV-curable resin introduced between the resin mold portion and the sleeve with ultraviolet rays, and a structure for restricting the flow of the resin changing into a flowing state during the sleeve securing operation or a structure for improving the adhesion durability of the sleeve is provided on at least one of the sleeve side and resin mold portion side.

Optical module

An electronic circuit is formed on a wiring substrate capable of cross wiring, and an electrode of the wiring substrate and a connecting portion of a lead frame are electrically connected to each other without wire bonding. As a consequence, while the substrate size is enhanced, the wiring pitch is reduced, whereby the electronic circuit can have a larger area and a larger scale. Further, the difference between the thickness of the encapsulating resin on the upper surface of the lead frame from the upper surface of the wiring substrate and the thickness of the encapsulating resin on the lower surface of the lead frame is made smaller than the thickness of the wiring substrate, whereby the occurring stress is reduced, and the encapsulating resin is kept from being distorted or cracking. Here realized is an optical module having a configuration in which, while the electronic circuit has a larger scale, the stability and durability are maintained.

The present invention relates to an optical data link having a structure which is quite easy to manufacture at a low cost and realizes high optical accuracy, high mechanical accuracy, and high reliability. This optical data link comprises a light-receiving module for outputting an optical signal from an optical fiber transmission line as an electric signal, and a light-emitting module for transmitting the optical signal to the optical fiber transmission line. Each of these optical modules comprises a body portion including an electronic device; a head portion including a light-receiving device or light-emitting device; and a neck portion, processed into a predetermined form, for communicating the body portion and head portion to each other. The optical modules are mounted on an insulating substrate, and are at least partly accommodated in a housing, while being separated from each other by a predetermined distance.

Optical data link

There is disclosed a light-receiving device comprising an absorption layer formed of a semiconductor material which is capable of generating electric charges in response to an incident light, a plurality of light-detecting regions formed in the absorption layer, each outputting an electric signal in response to an incident light signal, and a depletion region formed between the adjacent light-detecting regions for collecting electric charges generated in a portion of the absorption layer between the adjacent light-detecting regions.

Light-receiving device

It is an object of the present invention to provide an optical module having a structure in which alignment precision of sleeves to be accommodated to a housing can be improved with a simple operation. The optical module according to the present invention is characterized by providing special structures for defining the positions of the sleeves to a sleeve holder for holding the sleeves, and the housing having a cavity for accommodating the sleeves. In particular, the housing includes support portions each having a reference surface for defining the fixing position of the corresponding sleeve. The sleeve holder includes spring pieces each for urging the sleeve to the reference surface.

Optical module having structure for defining fixing position of sleeve

A connector which can be assembled easily with high accuracy and prevents the increase of the cost of each part includes a distinctively shaped lens constituting an optical system between independent optical devices. The lens is a lens that a support portion is integrally molded with an optically functioning portion as a sleeve for fixing a ferrule put on an end of an optical fiber at a predetermined position to insert the end of the optical fiber. The support portion protrudes along an optical axis of the optically functioning portion.

Connector including opposing lens surfaces, side surfaces, and contact

A semiconductor element module of the invention comprises a sleeve, a stem, a semiconductor light-emitting or light-receiving element, and a converging lens. In the sleeve, a fitting portion in which a ferrule for positioning an optical fiber is to be fitted is formed from its one open end toward the interior, an element housing portion coaxial with the fitting portion is formed from the other open end toward the interior, and a lens holding portion is formed to connect the fitting portion and the element housing portion. The stem is fixed to the sleeve at the other open end. The semiconductor light-emitting or light-receiving element is fixed on a surface of the stem on the element housing portion side. The converging lens is housed in the element housing portion and fixed to the sleeve, and optically couples an end face of the optical fiber to the light-emitting end face of the semiconductor light-emitting element or the light-receiving end face of the semiconductor light-receiving element. The material constituting the sleeve includes a metal having a thermal expansion coefficient close to that of a material constituting the converging lens.

Semiconductor element module

This invention relates to a light detecting device comprising a first conduction-type semiconductor substrate, a first conduction-type semiconductor crystal layer formed on the surface of the substrate, and a second conduction-type first region formed in the semiconductor crystal layer. The first region is surrounded by a second conduction-type second region. On the surface of the semiconductor crystal layer, an electrode is formed on the first region, and a reflection preventing layer is formed on that part of the first region inside the electrode, and a device protecting film is formed on that part of the first region outside the electrode. On the semiconductor crystal layer, a metal film is formed in contact both with the semiconductor crystal layer and with the second region. This structure enables the second region to capture unnecessary charges and further to recombine and extinguish them.

Semiconductor light detection device having secondary region to capture

A semiconductor light detecting device in which a housing with an optical fiber is inserted in is secured to a header with a photodiode chip mounted on integral therewith, and a light detecting surface of the photodiode chip is opposed to a light emitting surface of the optical fiber, the photodiode chip having a pn junction, the first region is surrounded by a second region of the second conductivity type formed at a portion of the semiconductor layer. The second region has the same or larger depth as or than that of the first region. Thus, even if a light is directed to the outside of the photo-sensing region, extra charges into the photo-sensing region is prevented. As a result, no optical lens system is necessary, and if an optical lens system is used, an inexpensive optical system may be used. Further, the device itself can be fabricated at low costs and easily.

Semiconductor light detecting device making use of a photodiode chip

A light absorbing layer, and a window layer formed thereon constitutes a first conduction-type semiconductor layer. In a part of this first conduction-type semiconductor layer there is provided a second conduction-type region extending to the light absorbing layer through the window layer. A part of the window layer around the second conduction region is selectively removed. Consequently even when light intended to enter a light detecting region is incident outside of the light detecting region, most of the carriers generated there are recombined at a surface level of the light absorbing layer before diffusing in a depletion layer. This light detecting device therefor does not substantially detect sensitivity to light incident outside the light detecting region.

Light receiving device

A bottom-incidence type photo-sensing device has a pn junction, as a photo-sensing region, formed by selectively providing a first region of a second conductivity type in a portion of a semiconductive layer of a first conductivity type. The first region is surrounded by a second region of the second conductivity type formed in the semiconductive layer, and the second region is of the same or larger depth as or that of the first region. Even when light is directed to outside of the photo-sensing region, extra charges generated therein are absorbed by the second region and the flow of extra charges into the photo-sensing region is prevented.

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Yokohama, Japan

Ichiro Tonai