Mitsubishi Denki Kabushiki Kaisha

Mita Industrial Co., Ltd.

Ichiro Takahashi

Kazuo Okahashi

Hiromi Ito

Goro Okamoto

Yoshifumi Ishii

Masami Kai

Satoshi Yano

Mitsuo Nomura

Hiroyuki Arai

Hiromi Sakata

Nobuhiko Kozuka

Shigeo Koyama

Osamu Hayashi

Takashi Nagashima

Toshiyuki Nakamura

Yoshitake Miyoshi

Hirozoh Kanegae

Hideo Fukuda

Atsushi Kano

Hideaki Tsudaka

Tsugio Nakanishi

Masanori Toyoda

Naoki Nakashima

Kou Shimomura

Sadamu Matsuda

Munetaka Mukainishi

Jiro Fujii

Shouichi Kitagawa

Masayoshi Okada

An image forming apparatus is provided with a binding function. A container, having a binding mechanism located in the bottom end thereof, is attached to the housing of the image forming apparatus. A guide member movable between a first positions in which the guide member is adjacent to the bottom end of the container, and a second position in which the guide member projects beyond the insertion opening of the container is provided to support a binder which is loaded in the container.

Image forming apparatus equipped with a binding function

An epoxy resin composition for encapsulating a semiconductor device includes a flexibilizer constituted by a pre-reaction product of an epoxy resin and a modified silicone oil having hydroxyphenyl groups, as well as a flexibilizer constituted by a pre-reaction product of a phenol resin and a modified silicone oil having epoxy groups. Furthermore, an epoxy resin is used as a chief material, and a curing agent is added. The epoxy resin composition is heat resistant and moisture resistant, and has a low modulus of elasticity, a low coefficient of expansion, and a high glass transition temperature equivalent to or higher than that of a conventional epoxy resin composition.

Flexibilizers of hydroxyphenyl silicone oil-epoxy resin product and

A binding unit binds sheets with a binder having an electric heater and electrodes for supplying electric current to the electric heater. The binding unit includes a container and an inner lid. The container has an insertion opening at one end through which the binder is inserted, and electrode terminals at the opposite end which come into contact with the electrodes of the binder. The inner lid is openable and provided in the container between the insertion opening and the electrode terminals. It assumes a closed position covering the electrode terminals when no binder is loaded in the container, and an open position allowing the electrodes of the binder to come into contact with the electrode terminals and at the same time supporting one side of the binder when loaded in the container. Consequently, when no binding operation is underway, the inner lid serves to prevent foreign material from dropping down onto the electrode terminals; and, when a binding operation is carried out, the binder is stably positioned in the container by the support of the inner lid, ensuring that the electrodes of the binder are securely in contact with the electrode terminals.

Binding unit for binding sheets in adherence to a binder

An epoxy resin composition for encapsulating a semiconductor device comprises a flexibilizer obtained by pre-reaction of an epoxy resin and at least one modified silicone oil having the formula: ##STR1## where R.sub.1, R.sub.3, and R.sub.4 are divalent organic groups; R.sub.21, R.sub.22, R.sub.23, R.sub.24, R.sub.25, R.sub.26, and R.sub.27 are respectively selected from the group consisting of an alkyl group having from 1 to 5 carbon atoms, a hydroxyalkyl group having from 1 to 5 carbon atoms, an alkoxy group having from 1 to 5 carbon atoms, a phenyl group, and a fluorine-substituted alkyl group having from 1 to 5 carbon atoms; a is an integer from 10 to 300; and b is an integer from 2 to 10, in which 0.ltoreq.b/(a+b).ltoreq.0.32, and wherein the equivalent ratio of phenolic hydroxyl groups in said modified silicone oil to epoxy groups of the epoxy resin of the flexibilizer is from 0.001 to 0.4:1; an epoxy resin other than the flexibilizer; and a curing agent.

Epoxy resin containing an epoxy resin-modified silicone oil flexibilizer

An apparatus for manually sending a sheet of paper to the sheet handling machine (i.e., a feeding mechanism inside of a copying machine or printer) equipped with an automatic sheet-feeding cassette. The sheet sending apparatus is composed of an upper chute and a lower chute articulated by gears. When the apparatus is used, the chutes make a flat angle to smoothly pass a sheet to the feed roller and the lower chute press down the stacked sheets of the sheet cassette. When the apparatus is not used, the chutes rotate and the lower chute leaves the feed roller. A sheet guide is attached at the lower end of the lower chute to prevent the sheet sliding on the chutes from falling in the sheet cassette, and the parts of the sheet guide corresponding to the separator of the sheet cassette is removed to allow natural flipping action of the sheet when the sheet is drawn out of the sheet cassette.

Sheet sending apparatus

Disclosed herein is an epoxy resin composition for sealing a semiconductor, which contains a flexibilizer, epoxy resin, a hardener, a hardening accelerator, a filler, a mold releasing agent, a colorant and a finishing agent. The flexibilizer is prepared from silicone containing hydroxyphenyl groups on ends of and/or in its molecules, which is formed of a copolymer of denatured silicone oil A having hydroxyphenyl groups, denatured silicone oil B having epoxy groups and/or bifunctional epoxy resin having epoxy groups on both ends. In addition to heat resistance, moisture resistance, a low elastic modulus, a low thermal expansion coefficient and a high glass-transition temperature, the epoxy resin composition according to the present invention has toughness which is higher than that of a conventional one, due to fine dispersion of silicone.

Epoxy resin composition for sealing semiconductor

A semiconductor sealing epoxy resin composition includes a flexibilizer which is a previous reactant between a denatured silicone oil having epoxy groups and a phenol novolak resin, a novolak type of epoxy resin, a hardening agent, an accelerator, a filler, a die lubricant, and a surface treatment agent. This composition has a heat and moisture resistance needs for a semiconductor sealing material, and as well as a low elastic modulus.

Semiconductor sealing epoxy resin composition

An electrode supporting conduit tube for electrical heating of underground hydrocarbon resources comprises a metal conduit tube and an insulating member adhered on and around the outer peripheral surface of the metal conduit tube. The insulating member is a laminated body of a web of glass fiber impregnated with water-dispersion varnish of a hot-water resistant and thermoplastic resin and a polyether/ether/ketone resin film, which is formed by first alternately winding the glass fiber web and the resin film on and around the outer peripheral surface of the metal conduit tube for a plurality of winding turns, and then subjecting both polyether/ether/ketone resin film and glass fiber web thus wound on and around the metal conduit tube to shaping under heat and pressure at a heating temperature of from 350.degree. C. to 450.degree. C, and under a pressure of from 10 kg/cm.sup.2 to 200 kg/cm.sup.2.

Electrode supporting conduit tube for electrical heating of underground

An electrode supporting conduit tube for electrical heating of underground hydrocarbon resources comprises a metal conduit tube; and an insulative covering adhered on and around the outer peripheral surface of the metal conduit tube, the insulative covering being a laminated body of polyether/ether/ketone resin and glass fiber, which is obtained by confining both polyether/ether/ketone resin and glass fiber wound on and around the metal conduit tube within a metal mold and subjecting the laminated materials to shaping under heat and pressure at a heating temperature of from 350.degree. C. to 450.degree. C. and a pressure of from 10 to 200 kg/cm.sup.2.

Electrode supporting conduit tube for electrical heating or underground

A conduct pipe produced by the process of:

Conduct pipe covered with electrically insulating material

A conduct pipe covered with an electrical insulating material, which is obtained by a process comprising winding a polyether ether ketone resin film around the outside of a metal conduct pipe, carrying out impregnation treatment in vacuum under pressure with using an impregnant resin comprising an ether bonding epoxy resin, and thereafter hardening by heating, is disclosed. The conduct pipe is particularly useful in an electrode apparatus for collecting underground hydrocarbon resources by an electrically heating method.

A conduit tube of an electrode device for electrically heating underground hydrocarbon resources, which comprises: a metal conduit tube and an electrically insulative covering adhered on and around the outer peripheral surface of said metal conduit tube, said electrically insulative covering being formed by adhering polyether/ether/ketone resin in powder form having particle size of a range of from 10 to 100 .mu.m on and around said metal conduit tube which has been preheated to a temperature range of from 350.degree. C. to 450.degree. C. by the electrostatic coating method, and fusion-bonding the electrically insulative covering material thereon at said temperature range of the preheating.

Conduit tube of an electrode device for electrically heating underground

A toner replenishing device for replenishing toner to a developing device in an electrostatic copying apparatus includes a storing box extending in approximately a horizontal direction, a supply roller provided at a supply port at an end of the storing box, pairs of wheels respectively provided at opposite ends of the storing box, a pair of endless stretched members passed around the wheels, a stirring and supply rod provided between the endless stretched members, and a device for driving the wheels so as to move the lower portion of the endless stretched members toward the supply roller.

Toner replenishing device for an electrostatic copying apparatus

A copying apparatus includes a copy paper cutting device which is operated when an original document or an optical device for exposure reaches a predetermined position. The original document or the optical device is stopped when a trailing edge of a copy paper is detected. After at least the leading edge of the copy paper passes through the copy paper cutting device, the copy paper is fed out entirely from an apparatus frame without operating the copy paper cutting device. This results in that the last copy paper sheet of the roll of copy paper is not shorter than the distance between transport rollers in the copy paper passageway to prevent a copy paper jam.

Growing community of inventors

Amagasaki, Japan

Ichiro Takahashi