Nitto-denko Corporation

National Institute of Advanced Industrial Science and Technology

Utsunomiya University

Ichiro Suehiro

Yuji Hotta

Hideyuki Usui

Fumiteru Asai

Miho Yamaguchi

Naoki Sadayori

Noriaki Harada

Kouji Akazawa

Junji Tominaga

Takashi Oda

Hiroyuki Katayama

Yoshinari Takayama

Takayuki Shima

Hirokazu Matsuda

Takashi Nakano

Daisuke Kitagawa

Masaru Sakamoto

Kazuma Kurihara

Yukitoshi Otani

Kazuya Fujioka

Shuhei Shibata

David Ignacio Serrano Garcia

Kazuki Uawada

Shunsuke Sasaki

The present disclosure relates to a plastic optical fiber (POF) core diameter measuring method and a POF core diameter measuring apparatus, and a POF defect detecting method, and a POF defect detecting apparatus used therefor. Light irradiation mechanisms are provided for irradiating a side of a POF with light, with imaging mechanisms provided on the opposite side of the POF from the light irradiation mechanisms; and a data processing mechanism for processing image data on the POF acquired from the imaging mechanisms to calculate the core diameter of the POF. The ratio (D/W) of the shortest distance D to a light emission width W is in the range of 0.9 to 1.3 where W is the light emission width of the light irradiation mechanisms and D is the shortest distance between a light emission position of the light irradiation mechanisms and the side of the POF.

Plastic optical fiber core diameter measuring method, plastic optical fiber core diameter measuring apparatus used therefor, plastic optical fiber defect detecting method, and plastic optical fiber defect detecting apparatus used therefor

Provided are a polarizing film imaging apparatus, a polarizing film inspection apparatus including the imaging apparatus, and a polarizing film inspection method using the imaging apparatus. The imaging apparatus includes: a light source that is configured to emit light toward a polarizing film to be inspected; an imaging unit that is arranged on an optical axis of the light source and on an opposite side to the light source with the polarizing film therebetween; and at least one of a circular polarizing plate arranged between the light source and the polarizing film, and a wavelength plate arranged between the polarizing film and the imaging unit.

Imaging apparatus for obtaining image of polarizing film, inspection apparatus, and inspection method

The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet ()) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m&#xb7;K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.

LED mounting substrate

An etching resist has a first heat-generating layer, a second heat-generating layer, and a metal compound layer including a metallic oxynitride layer containing a metallic oxynitride. The first heat-generating layer, the metallic oxynitride layer, and the second heat-generating layer are directly or indirectly laminated such that the metallic oxynitride layer is positioned between the first heat-generating layer and the second heat-generating layer.

Etching resist

The present invention relates to an encapsulating sheet for an optical semiconductor, including: a phosphor-containing layer containing a phosphor; and an encapsulating resin layer containing an encapsulating resin and being laminated on the phosphor-containing layer, in which, on the laminated surface therebetween, an edge of the phosphor-containing layer protrudes from an edge of the encapsulating resin layer, and a protruded length of the phosphor-containing layer is from 1 to 10 times a thickness of the encapsulating resin layer.

Encapsulating sheet for optical semiconductor

The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which Rand Reach independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R's are the same or different and a plurality of R's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.

Microlens array

The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.

Resin sheet for encapsulating optical semiconductor element and optical semiconductor device

The present invention provides a light pipe for a direct-type backlight having an upper surface and a lower surface, which has: a light reflecting member provided on the upper surface; and plural light scattering members formed concentrically on at least one surface selected from the upper surface and the lower surface, wherein each of the plural light scattering members is a circular groove or a circular projection, wherein each area between respective light scattering members is substantially the same.

Light pipe for direct-type backlight and direct-type backlight

The present invention provides A direct-type backlight having: a resin sealing member including at least one resin layer, which has a light reflecting section formed on the outermost surface of the resin sealing member; an optical semiconductor element sealed by the resin sealing member; and plural circular light scattering grooves formed concentrically on at least one surface of the resin layer, wherein an area of a circle in the center and an area among the respective concentric circles are substantially the same.

Direct-type backlight

An anisotropic conductive film is prepared by winding an insulated wire around a core member to form one roll of a winding layer, placing an insulating resin film on the obtained winding layer, and repeating the step of winding the insulated wire and the step of placing the insulating resin film to give a laminate alternately having the winding layer comprising a single row of insulated wires and an insulating resin layer made from the insulating resin film. A coating layer and insulating resin layer are melted to integrate the winding layer and the insulating resin layer. The laminate then is sliced along a plane forming an angle with the insulated wire in a desired film thickness.

Method of manufacturing an anisotropic conductive film

A microlens array having a resin layer forming convex lenses, wherein the resin layer comprises a cured product of a polycarbodiimide resin represented by formula:wherein R represents a diisocyanate residue; Rrepresents a monoisocyanate residue; and n represents an integer of 1 to 100.

Growing community of inventors

Ibaraki, Japan

Ichiro Suehiro