Nippon Shokubai Co., Ltd.

Ichiro Namura

Masaya Yoshida

Masatoshi Yoshida

Tadahiro Yoneda

Kenji Minami

Masuji Izubayashi

Shigefumi Kuramoto

Kiyoshi Kawamura

Nobuhisa Noda

Satoshi Ishida

Daijo Tomihisa

An epoxy resin composition which is tough and has excellent heat resistance and adhesion is obtained by dispersing, in an epoxy resin, polymer particles with a glass transition temperature of lower than 20.degree. C. obtained by emulsion polymerization of a (meth)acrylic acid ester monomer by using, as an emulsifier, an end alkyl group-containing polymer with an acid value of greater than 200 or a salt thereof obtained by polymerization of a polymerizable monomer containing an unsaturated carboxylic acid in the presence of an alkyl mercaptan. The epoxy resin composition is useful, for example, as adhesives, molding materials, paints, sealants.

(Meth)acrylate polymer particles dispersed in epoxy resin

Compound fine particles include inorganic fine particles and an organic polymer bound to surfaces of the inorganic fine particles, and have an average particle diameter of 5 to 200 nm and a particle diameter variation coefficient of 50% or less. The compound fine particles are obtainable by hydrolyzing and condensing an organic polymer, wherein the organic polymer has, per molecule, at least one polysiloxane group containing at least one Si--OR.sup.1 group, wherein R.sup.1 denotes a hydrogen atom, an unsubstituted or substituted alkyl group, or an unsubstituted or substituted acyl group. A compound fine particle dispersion includes the compound fine particles and a dispersion medium. A composition for forming a film includes this dispersion.

Compound fine particles and composition for forming film

The thermosetting resin composition of the present invention comprises: a polymer (A) containing at least one monomer selected from ethylenically unsaturated dicarboxylic anhydride, mono-ester thereof and mono-amide thereof as a repeating unit; and a polymer (B) containing an addition-polymerizable oxazoline and a hydroxyl group-containing monomer as repeating units, which can rapidly form a cured film excellent in acid rain resistance and other properties at relatively low temperature of 70.degree. to 140.degree. C. The further incorporation of a basic compound (C) and/or a compound (D) selected from the group consisting of a monohydric alcohol, a .beta.-diketone and an ortho-carboxylic ester to this thermosciting resin composition can give a remarkably improved storage stability to this resin composition as a one-part type composition. This thermosciting resin composition can exhibit excellent properties as a top clear coating for motor vehicle.

Thermosetting resin composition

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Suita, Japan

Ichiro Namura