Tokyo Electron Limited

Ichiro Namioka

Toshihiko Iijima

Taku Mizutani

Shigenori Todate

Takahiro Ito

A manufacturing process system includes: a plurality of processing devices which processes workpieces, with respective equipment associated with the plurality of processing devices; a transfer device which transfers the workpieces to the plurality of processing devices; a host computer which performs creating a transfer plan including information of timings at which the workpieces are carried in and out by the transfer device and acquiring an operation schedule including information of maintenance time from the plurality of processing devices; and a processing device group controller which performs acquiring the transfer plan and the operation schedule from the host computer, comparing the transfer plan and the operation schedule of each processing device, specifying the last process before maintenance for each processing device, detecting the end timing of the specified process, and instructing each processing device to be switched to an idle state at the end timing along with the associated equipment.

Processing device group controller, manufacturing process system, processing device group control method, manufacturing optimization system, manufacturing optimization device, and manufacturing optimization method

There is provided a production processing system including: a production efficiency improvement device configured to select a processing apparatus that processes workpieces in consideration of a position of each of a plurality of processing apparatuses arranged along a transfer path; and a transfer control device configured to move a transfer apparatus that transfers workpieces from a predetermined position on the transfer path to the selected processing apparatus.

Modifying operational efficiency by repositioning process apparatus

Disclosed is a failure monitoring system for monitoring a failure of a substrate processing apparatus that performs a predetermined processing on a substrate to be processed, the failure monitoring system including: an alarm collecting unit configured to collects alarms issued from the substrate processing apparatus; and an analyzing unit configured to analyze the alarms collected by the alarm collecting unit and display, as an image, an alarm issuing frequency in each monitoring period on a two-dimensional space, of which one axis represents an alarm ID that specifies an alarm issuing area and another axis represents a predetermined monitor period.

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Tokyo, Japan

Ichiro Namioka