Murata Manufacturing Co., Ltd.

Ichiro Nakamura

Norihiro Yoshikawa

Yasunori Hioki

Shinichi Kobayashi

Tomomichi Ichikawa

Ichiro Nakaso

Tomoki Inakura

Hidehiko Tanaka

Akihiro Motoki

Makoto Ogawa

Kenichi Kawasaki

Shunsuke Takeuchi

Toshiyuki Iwanaga

Kiyoyasu Sakurada

Tomoaki Onoue

Kazuyuki Naka

Hisao Kawamura

Kiyoko Ueda

Toshiya Anahara

Hiroyuki Kurihara

A dielectric resin composition for a film capacitor is a mixture containing an organic material A and an organic material B. The organic material A includes at least two kinds of organic material components A, A, . . . having reactive groups (for example, OH, NCO) that cross-link each other. The organic material B does not have a reactive site capable of reacting with the organic material A and has a dielectric loss tan &#x3b4; of 0.3% or less at a temperature of 125&#xb0; C. The mixture has a glass transition temperature of 130&#xb0; C. or higher and preferably 280&#xb0; C. or lower.

Dielectric resin composition for film capacitor and film capacitor

To increase the heat resistance of a film capacitor, a dielectric resin composition is used as a material for a dielectric resin film used in a film capacitor, the dielectric resin composition being cured by mixing and crosslinking two or more organic materials having functional groups that react with each other to provide a cured article. At least one pair highly cohesive atomic groups which has a molecular cohesive energy equal to or higher than that of a methyl group and capable of cohering with each other due to the molecular cohesive energy is linked to the organic material. The highly cohesive atomic groups form a cohesive portion serving as pseudo-crosslinking.

To increase the heat resistance of a film capacitor, a cured article obtained by curing a mixed solution of a polyvinyl acetal having a hydroxyl group content of 10% to 38% by weight, the number of backbone carbon atoms of the polyvinyl acetal being 100 or more, and a polyisocyanate having an isocyanate content of 1% to 50% by weight is used as a dielectric resin films material arranged between first and second counter electrodes facing each other. At least the polyvinyl acetal is subjected to high-pressure homogenization in which a shearing force is applied such that a pressure applied to the polyvinyl acetal is 50 MPa or more when the material is passed through a path having a diameter of 0.125 mm and a length of 5 mm, so that the solubility is increased to allow a curing reaction to proceed uniformly. The cured article has a glass transition temperature of 130&#xb0; C. or higher and a breakdown voltage of 350 V/&#x3bc;m or more.

Provide is a separator for a power storage device, which reliably prevents short circuits between positive and negative electrode layers while maintaining the permeating ions function, and effectively suppresses shrinkage, and a power storage device using the separator. The separator is composed of a composite material including inorganic microparticles and an organic binder, the composite material has a pigment volume concentration of 55% or more, and the inorganic microparticles have an average particle size in the range of 0.2 to 3.0 &#x3bc;m, and a general particle shape index in the range of 0.50 to 0.85. The composite material can have a pigment volume concentration in the range of 55 to 80%, or 55 to 65%.

Separator for power storage device and power storage device

When external electrodes of a multilayer ceramic capacitor are formed by performing direct plating on surfaces at which internal electrodes are exposed without forming paste electrode layers, bonding forces of plating layers are relatively weak, and in addition, when glass particles are included in the plating layers, blisters are often generated. To overcome these problems, a multilayer ceramic capacitor is formed by performing electrolytic plating using a plating bath including glass particles, electrolytic plating layers including glass particles dispersed therein are formed as the external electrodes.

Ceramic electronic component and method for manufacturing the same

A process for producing resin-coated metal particles includes coating surfaces of metal particles with silica; allowing a polymerizable group to adsorb onto the surfaces of the silica-coated particles by the use of a silane coupling agent; and coating the surfaces of the silica-coated particles with a polymeric resin by mixing the particles to which the polymerizable groups have been adsorbed, a polymerizable monomer, a polymerization initiator, and a dispersant to polymerize the polymerizable monomer and the polymerizable groups.

Process for producing resin-coated metal particles, resin-coated metal particles, and toner for forming circuit

A composite dielectric sheet used to manufacture a multilayer electronic component. The composite dielectric sheet is flexible and has a high dielectric constant and high dielectric strength. The composite dielectric sheet contains a polyvinyl acetal resin; a high-dielectric constant filler, surface-treated with a coupling agent, dispersed in the polyvinyl acetal resin; and a crosslinking agent having two or more functional groups reactable with the polyvinyl acetal resin and the surface-treated high-dielectric constant filler. The composite dielectric sheet is suitable for use in a multilayer electronic component such as a monolithic capacitor.

Composite dielectric sheet, method for producing composite dielectric sheet, and multilayer electronic component

A ceramic slurry composition has a powdered ceramic uniformly dispersed therein without excessive damage thereto. A method for producing a ceramic green sheet using the ceramic slurry composition and a method for producing multilayer ceramic electronic devices are also disclosed. The ceramic slurry composition contains the powdered ceramic, a dispersing agent, a binder and a solvent, in which an anionic dispersing agent is used as the dispersing agent, and the content of the anionic dispersing agent is set to be such that the total acid content thereof corresponds to about 10 to 150% of the total base content of the powdered ceramic. In addition, the powdered ceramic having an average particle diameter of about 0.01 to 1 &#x3bc;m is used.

Ceramic slurry composition and methods for producing ceramic green sheet and multilayer ceramic electronic device

A ceramic green sheet is manufactured by preparing a support which includes a releasing layer formed on its top surface and has a smoothness that at least a region of the top surface of the support to be coated with a ceramic slurry has substantially no projections having a height of equal to or more than about 1 &mgr;m, and applying a ceramic slurry to the releasing layer of the support, which ceramic slurry contains a ceramic powder dispersed in a medium. This ceramic green sheet has a small thickness of, for example, about 0.3 to 3 &mgr;m, has no depressions or through holes caused by a filler in the support and is excellent in smoothness.

Methods for manufacturing ceramic green sheet and multilayer ceramic electronic parts

A ceramic slurry composition has a powdered ceramic uniformly dispersed therein without excessive damage thereto. A method for producing a ceramic green sheet using the ceramic slurry composition and a method for producing multilayer ceramic electronic devices are also disclosed. The ceramic slurry composition contains the powdered ceramic, a dispersing agent, a binder and a solvent, in which an anionic dispersing agent is used as the dispersing agent, and the content of the anionic dispersing agent is set to be such that the total acid content thereof corresponds to about 10 to 150% of the total base content of the powdered ceramic. In addition, the powdered ceramic having an average particle diameter of about 0.01 to 1 &mgr;m is used.

Ceramic slurry composition

A method of producing ceramic slurry capable of producing uniformly dispersed ceramic slurry without excessively damaging a ceramic powder, and a method of producing a ceramic slurry composition used for producing a multilayer ceramic electronic part, from which an undissolved binder is precisely removed. Also provided is a method of producing a ceramic green sheet, and a method of producing a multilayer ceramic electronic part. A ceramic powder having an average particle diameter of about 0.01 to 1 &mgr;m is mixed with a dispersion solvent (solvent) and disintegrated by a medium-type dispersion method using a dispersion medium such as balls, beads, or the like to obtain mixed and disintegrated slurry, followed by high-pressure dispersion under a pressure of about 100 kg/cm or more. The ceramic slurry composition contains a ceramic powder, a dispersant, a binder, and a solvent, wherein a binder solution prepared by mixing a solvent and the binder to form a solution, and dispersing the binder under a high pressure of about 100 kg/cm or more is used as the binder to decrease the content of the undissolved binder.

Method of producing ceramic slurry, ceramic slurry composition, ceramic green sheet and multilayer ceramic electronic part

A method for producing a ceramic slurry used for fabricating a ceramic electronic component includes a mixing and pulverizing step for mixing and pulverizing a ceramic powder having an average particle size of about 0.01 to 1 &mgr;m, a solvent and a dispersant by a dispersion process using a pulverizing medium, such as balls or beads, to obtain a mixed and pulverized slurry; and a high pressure dispersion step for performing high pressure dispersion at a pressure of about 100 kg/cm or more after a filtered binder solution is added to the mixed and pulverized slurry to obtain a dispersed slurry (final dispersed slurry), the filtered binder solution being prepared by dissolving a binder in a solvent, followed by filtration. A method for forming a ceramic green sheet and a method for fabricating a monolithic ceramic electronic component using the ceramic slurry are also disclosed.

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Kusatsu, Japan

Ichiro Nakamura