Hitachi, Ltd.

Ichiro Miyano

Suguru Sakaguchi

Hiroyuki Tanaka

Koji Serizawa

Tadao Shinoda

Toshiharu Ishida

Kooji Serizawa

Hiroshi Nakamura

Masachika Masuda

Junichi Saeki

Isamu Yoshida

Sueo Kawai

Naoya Kanda

Shigeharu Tsunoda

Ritsuro Orihashi

Kunio Matsumoto

Michifumi Kawai

Hideo Yamakura

Ikuo Kawaguchi

Tooru Yoshida

A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.

Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof

An ultra-thin resin molded semiconductor device of high reliability with low cost and with easy repair at time of mounting. A plurality of these semiconductor devices are stacked to provide a semiconductor module which has a higher function than semiconductor devices in the same volume, and a card type module utilizing assembled by the stacked semiconductor module is provided. In manufacturing the semiconductor module, an extremely thin lead frame and an LSI chip are directly connected together, and the mirror surface of the LSI chip is exposed by using a low viscosity epoxy resin to have a thin molding. The mirror surface is grinded to have a further thin thickness of the whole structure of the semiconductor device. A part of the lead frame is formed as a reinforcing member, a heat radiation path, a light shielding part for shielding the LSI from harmful light beams, or a positioning base for mounting a substrate. The above ultra-thin resin molded semiconductor devices are interconnected together in a stacked layout to provide a stacked semiconductor module, and to provide a card type device having a higher function.

Semiconductor device structure

A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip-semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.

Film carrier tape and laminated multi-chip semiconductor device

In a tape carrier type semiconductor device with reinforcement wherein tape carrier type semiconductor modules are mounted in holes or depressions enclosed by a frame, and at least one flexible circuit is stacked additionally as required, and the semiconductor modules are electrically connected to electrodes formed on the frame, by mounting chip parts such as capacitors on the frame and/or flexible circuit, the mounting area of the semiconductor device can be reduced and the performance can be hyperfunctioned. By stacking a plurality of such semiconductor devices with reinforcement, much more satisfactory effects can be obtained.

Semiconductor device with reinforcement

A method for producing an electronic part mounting structure in which electronic parts such as IC packages are electrically connected to the surface of a printed circuit board utilizes a low-melting point metal. More particularly, the method provides an electronic part mounting structure capable of sufficiently and assuredly supplying solder to a portion between the terminal of a printed circuit board and the leads of an electric part while maintaining a predetermined thickness required to connect the printed circuit board and the electronic part to each other. By arranging the structure such that a gap, in which a solder layer having a predetermined thickness can be formed between the terminal of the printed circuit board and the lead of the electronic part to be connected to the terminal, is formed, the solder required to solder-connect the two elements can be sufficiently and assuredly supplied to the gap. Therefore, a reliable solder connection can be established.

Method for producing electronic part mounting structure

Growing community of inventors

Fujisawa, Japan

Ichiro Miyano