Tokyo Seimitsu Co., Ltd.

Tosei Engineering Corporation

Ichiro Katayama

Kazumi Ikeda

Yoshio Kamoshita

Masatami Iwaki

Shozo Katamachi

Shinji Shibaoka

Youichi Nakamura

A truing method for a chamfering grindstone for performing chamfering work on a peripheral edge of a plate-shaped object, comprising the steps of: performing chamfering work on a truing grindstone with a master grindstone having a desired groove shape and forming a peripheral edge shape of the truing grindstone into a desired chamfered shape; and transferring the groove shape of the master grindstone onto the chamfering grindstone by performing grooving work on the chamfering grindstone with the chamfered truing grindstone to form the groove in the desired shape on the chamfering grindstone.

Method of truing chamfering grindstone and chamfering device

A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.

Apparatus and method for chamfering wafer

The moving direction of the wire line 15A at the cut portion 44 for cutting the columnar semiconductor ingot 18 corresponds to the vertical-downward direction. And, the semiconductor ingot 18 supported with the cut-feed means 20 is fed horizontally so as to be pushed in perpendicular to said wire line 15A, and the processing liquid 42 is supplied to the wire line 15A from the grind liquid supply nozzle 40 placed at the upper side of the cut portion 44. Therefore, the processing liquid 42 supplied to the wire line 15A flows along the wire line 15A, so that the processing liquid 42 can be surely supplied to the cut portion 44.

Wafer cut method with wire saw apparatus and apparatus thereof

Picking up means pick up a wafer from a first cassette one by one and carry the wafer to a pre-processing means. The wafer is picked up from the pre-processing means after the measuring and deciding the position has been completed in the pre-processing means. First carrying means receives the wafer from the picking up means and resets the position of the wafer. The first carrying means mounts the wafer on the wafer table of the first chamfering means in the case that the first chamfering part is not chamfering the wafer. The first carrying means carries the wafer and mounts it on the second wafer table of the second chamfering means in the case that the first chamfering part is chamfering the wafer.

Chamfer grinding system for wafer

A slicing machine for slicing an ingot using a rotary blade that maintains the inner peripheral cutting edge of the blade in a highly rigid state. The slicing machine slices the ingot into thin pieces by use of an inner peripheral cutting edge of a doughnut-shaped rotary blade in which an axial force is applied to the blade prior to slicing in order to displace the blade in an axial direction. The inner peripheral cutting edge of the blade is kept rigid and the ingot is sliced accurately. The displacement of the blade is stored and controlled by a control unit.

Slicing machine employing an axial force to provide rigidity to a rotary

A slicing method includes slicing an ingot by a rotary blade while the inner peripheral cutting edge of the blade is kept in a highly rigid state. A slicing machine slices the ingot into thin pieces by use of an inner peripheral cutting edge of a doughnut-shaped rotary blade, where an axial force is applied to the blade prior to slicing in order to displace the blade in an axial direction. The inner peripheral cutting edge of the blade is kept rigid and the ingot is sliced accurately. The displacement of the blade is stored and controlled by a control unit.

Slicing machine and a slicing method by the same

A slicing method by use of a slicing machine in which, after a cylindrical material is moved by a predetermined amount of indexing, the cylindrical material is moved to a rotating blade in the slicing direction of the blade and is sliced into a wafer having a predetermined thickness, and at the same time the end face of the cylindrical material is ground. In the slicing method according to the invention, the grinding position and the amount of indexing of the cylindrical material can be corrected in accordance with the actually measured data of the thicknesses of the wafer after slicing, the data of axial displacements of the blade detected during slicing, and the actually measured data of the shapes of the end face of the cylindrical material after slicing of the wafer. Thus, the grinding position can be calculated accurately, the loss of the cylindrical material can be minimized, and the slicing can be carried out with an accurate amount of indexing, so that the wafer can be manufactured with high accuracy.

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Mitaka, Japan

Ichiro Katayama