Canon Kabushiki Kaisha

Ichiro Kataoka

Satoru Yamada

Hidenori Shiotsuka

Takahiro Mori

Ayako Komori

Shigenori Itoyama

Akiharu Takabayashi

Shigeo Kiso

Hideaki Zenko

Ayako Shiotsuka

Tadashi Kosaka

Yuji Inoue

Masaaki Matsushita

Yoshifumi Takeyama

Hidehisa Makita

Koji Tsuduki

Makoto Sasaoka

Fumitaka Toyomura

Satoru Shiomi

Takaaki Mukai

Soichiro Kawakami

Shin Hasegawa

Hiroshi Kondo

Toshihiko Mimura

Kimitoshi Fukae

Tsutomu Murakami

Takehito Yoshino

Masahiro Mori

Koichi Shimizu

Osamu Hamamoto

Takeshi Takada

Takahiro Hachisu

Koji Tsuzuki

Tomoyuki Tamura

Koji Tamura

Kazuya Notsu

Hisatane Komori

Kunihiko Minegishi

Yu Katase

Kazuya Igarashi

Fujio Ito

Sigeo Kiso

A module, comprising an electronic component having a first electrode, a mounting board having a second electrode, a solder-bump configured to connect the first electrode and the second electrode, and a thermoplastic resin member configured to contact both the first electrode and the second electrode and cover the solder-bump, so as to form a space between the electronic component and the mounting board.

Module, method for manufacturing the same, and electronic device

A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.

Method for producing a module

A mounting member includes a plurality of internal connecting portions, each of which is electrically connected to an electronic device, and a plurality of external connecting portions, each of which is soldered, wherein the plurality of external connecting portions include a first connecting portion in communication with at least any of the plurality of internal connecting portions, and a second connecting portion different from the first connecting portion, and surfaces of the first connecting portion and the second connecting portion include gold layers, and a thickness of the gold layer of the second connecting portion is smaller than a thickness of the gold layer of the first connecting portion.

Mounting member, electronic component, and method for manufacturing module

An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.

Electronic component, electronic apparatus, and method for manufacturing the electronic component

Provided is a method of manufacturing a semiconductor element having at a cut portion with excellent quality, which minimizes a region on a silicon substrate necessary for cutting, and which prevents cutting water used when cutting by dicing is carried out from entering the semiconductor element. The method of manufacturing a semiconductor element includes: arranging, on the silicon substrate, multiple semiconductor element portions so as to be adjacent to one another; bonding the silicon substrate and a glass substrate together using the resin; and cutting the silicon substrate and the glass substrate, respectively, in a region in which the resin is provided, the cutting the silicon substrate and the glass substrate including: half-cutting the silicon substrate by dicing; cutting the glass substrate by scribing; and dividing the silicon substrate, the glass substrate, and the resin.

Method of manufacturing semiconductor element

A substrate, an array of organic electroluminescence element groups disposed on the substrate, each organic electroluminescence element group formed of a plurality of organic electroluminescence elements, a protective layer disposed on the array of organic electroluminescence element groups, and a laminate member disposed on the protective layer were divided between the array of organic electroluminescence element groups into a plurality of organic electroluminescence panels.

Method for manufacturing organic electroluminescence panel

A light-emitting element includes a protective layer in contact with an upper electrode and a circular polarizer in contact with the protective layer.

Light-emitting device comprising protective layer with irregular surface

There is disclosed a method of producing a solar cell module comprising the steps of: mounting a body to be laminated onto a tabular member, carrying in the body to be laminated along with the tabular member onto a heated mounting board; heat-bonding the body to be laminated by pressing with an expanding unit; carrying out the body to be laminated along with the tabular member from the mounting board after parting the expanding unit from the body to be laminated; and separating the body to be laminated from the tabular member. By using the method, a temperature of the body to be laminated does not increase rapidly and a foaming phenomenon is suppressed, thereby allowing manufacturing of the solar cell module with a high yield.

Method of producing solar cell module

A solar cell module includes a front member placed at a light-incident side of the module; a sealing member having an exposed section that is not covered with the front member; solar cell elements that are sealed with the sealing member and covered with the front member; and an electric device, stored in a housing, for extracting electricity generated by the solar cell elements. The housing is fixed on the exposed section and is located at a light-incident side of the module.

Solar cell module having an electric device

The present invention provides a method for manufacturing a solar cell module having photovoltaic elements in each of which a metal oxide layer made of a metal oxide forms an outermost surface part thereof at a light incident side, and a sealing resin layer formed on the metal oxide layer. The method includes the steps of providing water on a surface of the metal oxide layer, the water being chemically adsorbed thereto; irradiating the metal oxide layer with electromagnetic waves for a predetermined time so that the contact angle of the water on the surface of the metal oxide layer is 60&#xb0; or less, the electromagnetic waves having energy larger than the band gap of the metal oxide; and subsequently forming the sealing resin layer on the metal oxide layer.

Method for manufacturing solar cell module having a sealing resin layer formed on a metal oxide layer

Provided is a solar cell module having a reinforcing member integrally stacked by means of a covering material on a rear surface of a solar cell panel having a photovoltaic element that performs photoelectric conversion, wherein a bent portion is formed in each of opposing end portions of the reinforcing member, an output wire member having conductivity is extended from an output portion of the photovoltaic element disposed on a light-receiving surface side of the solar cell panel along a surface of the bent portion so as to get over the bent portion, and a tip end of the extended portion of the output wire member is exposed out of a surface opposite to the reinforcing member of the covering material to form an output terminal portion. Thereby, there is provided a solar cell module that is improved in the area efficiency and weather resistance as well as the workability of electrical wiring and electrical connection during manufacturing and is inexpensive.

Solar cell module

A process for producing a substrate having a coating resin layer includes the steps of carrying in a substrate on a fastening table and fastening the substrate to the table and, while moving a spout for spouting a resin layer precursor or the fastening table in a horizontal direction, spouting the resin layer precursor to apply the resin layer precursor onto the substrate to form a resin layer precursor layer on the substrate. Additional steps include carrying out the substrate having the resin layer precursor layer from the fastening table, and drying and curing the resin layer precursor layer on the substrate to form a coating resin layer on the substrate.

Process and apparatus for producing a substrate having a coating resin layer

A solar cell module comprising a substrate, a filler, a photovoltaic element and a protective layer, wherein at least one of the substrate, the filler, the photovoltaic element and the protective layer is separable from other constituent members. Constituent members having been separated and still serviceable can be reused.

Semiconductor device, solar cell module, and methods for their dismantlement

A photovoltaic element has a first collecting electrode and a second collecting electrode on a light-receiving surface and has a configuration in which the first and the second collecting electrodes are electrically joined to each other on an insulating member. In the photovoltaic element, a second resin layer having a high compatibility with a component of the insulating member covers a boundary between the insulating member and a first resin layer formed on the light-receiving surface, thereby achieving cost reduction and improvement in durability.

Photovoltaic elements

Semiconductor encapsulant resin having an additive with a gradient concentration

Growing community of inventors

Nara, Japan

Ichiro Kataoka