Mitsubishi Denki Kabushiki Kaisha

Ichiro Hayashi

Toshio Takeuchi

Shuichi Osaka

Toshio Komemura

Masahiro Ishizuka

A method of and an apparatus for producing semiconductor devices, in which a semiconductor wafer is adhered to an ultraviolet tape the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet tape being adhered to a frame ring so that the semiconductor wafer is fixed to the frame ring through the ultraviolet tape. Successive semiconductor wafers thus fixed to respective frame rings are subjected to a series of steps including dicing, breaking and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided into dices and held by the ultraviolet tape with reduced adhesiveness is sent to a next step such as die-bonding step.

Apparatus for producing semiconductor device

A method and an apparatus for producing semiconductor devices in which a semiconductor wafer is adhered to an ultraviolet sensitive tape, the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet sensitive tape being adhered to a ring frame so that the semiconductor wafer is fixed to the ring frame with the ultraviolet sensitive tape. Successive semiconductor wafers thus fixed to respective ring frames are subjected to a series of steps including dicing, breaking, and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided in dice and held by the ultraviolet sensitive tape with reduced adhesiveness, is sent to a next step, such as a die-bonding step.

Method of dividing semiconductor wafer using ultraviolet sensitive tape

A semi-full cut semiconductor wafer is put on an adhesive sheet attached to a ring frame. Then, the semiconductor wafer is pushed upward from the back surface of the adhesive sheet by a rotatable breaking member in the shape of a disk the edge portion of which is triangular in section. In this state, the ring frame is moved so that the breaking member may not deviate from dicing lines, whereby the semiconductor wafer is divided into a large number of chips.

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Itami, Japan

Ichiro Hayashi