Elpida Memory, Inc.

Elpidia Memory, Inc.

Ichiro Anjoh

Mitsuhisa Watanabe

A semiconductor apparatus includes a semiconductor chip in which a plurality of electrode pads are provided on a main surface, and a plurality of bump electrodes are provided on the electrode pads of the semiconductor chip. The semiconductor apparatus also includes a wired board which is allocated in a side of the main surface of the semiconductor chip, and is positioned in a central area of the main surface of the semiconductor chip so as to be separated from an edge part of the semiconductor chip by at least 50 &#x3bc;m or more. The semiconductor apparatus also includes a plurality of external terminals which are provided on the wired board, and which are electrically connected to a plurality of bump electrodes through wirings of the wired board, and sealing part which is provided between the semiconductor chip and the wired board, is made of underfill material that covers a connection part between the bump electrode and the wiring.

Semiconductor device

Semiconductor deviceincludes: first wiring boardprovided with a plurality of external terminalson the under surface thereof; first semiconductor chipwith the under surface thereof mounted on the upper surface of first wiring board; and second semiconductor chipwith the under surface thereof mounted on the upper surface of first semiconductor chip. On the upper surface of first wiring board, connecting padand connecting padare provided, while connecting padis electrically connected with the under surface of first semiconductor chipand connecting padis arranged closely to an end portion of first semiconductor chip. Connecting padand connecting padare electrically connected with external terminals. Semiconductor devicefurther includes: connecting padprovided as contacting or as being close to an upper end portion of second semiconductor chipwhile being electrically connected with the upper surface of second semiconductor chip, and wirewhich electrically connects connecting padand connecting pad

Module with stacked semiconductor devices

A method of making a semiconductor apparatus provides a plurality of electrode pads on a main surface of a semiconductor chip, and a plurality of bump electrodes on the electrode pads. The method also provides a wired board which is allocated in a side of the main surface of the chip and is positioned in a central area of the main surface of the chip so as to be separated from an edge part of the chip by at least 50 &#x3bc;m or more, a plurality of external terminals on the wired board and which are electrically connected to a plurality of bump electrodes through wirings of the wired board, and a sealing part between the chip and the wired board, the sealing part being made of underfill material that covers a connection part between the bump electrode and the wiring.

Method of manufacturing a semiconductor apparatus

A semiconductor device according to the present invention is provided with a semiconductor chip in which a plurality of electrode pads is provided on a principal surface, a plurality of bump electrodes provided on the electrode pads of the semiconductor chip, a square-shaped wiring board which is disposed on a side of the principal surface of the semiconductor chip, and in which at least two sides of an outer circumference that face each other are positioned in an area on the principal surface of the semiconductor chip, a plurality of external terminals which is provided on the wiring board, and which are electrically connected to a plurality of the bump electrodes through a wiring of the wiring board, and sealing material which is provided between the semiconductor chip and the wiring board, and which covers a connection part between the bump electrode and the wiring.

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Tokyo, Japan

Ichiro Anjoh