Somar Corporation

Ichio Fukuda

Fumio Hamamura

Sigeo Sumi

Noriyasu Sawada

Mitsuhiro Seki

Shigeo Sumi

A film peeling apparatus is disclosed wherein a base plate stuck with the films is conveyed to a film peeling position, where a contact tightness of leading edges of the films to the base plate is reduced by a film contact tightness reducer while relative moving speed of the base plate and the reducer is decreased by slowing down the conveyance speed of the base plate or by moving the reducer in synchronism with the conveyance of the base plate without stopping the conveyance of the base plate.

Film peeling method and apparatus for practicing same

An apparatus for bonding a multi-layer thin film onto a substrate and for removing a layer of the film. A printed circuit board having a multi-layer film bonded to a planar surface thereof has one layer of the film lifted at a leading edge by vibration and fluid pressure. The leading edge is mechanically gripped and a pulling force applied thereto to draw the film from the surface of the circuit board and to transfer the removed film along a path to a discharge apparatus. The transfer apparatus includes frictionally engaged belts which direct the film along a transfer path to a source of ionized fluid which is applied to the film in order to remove static and direct the film along the transfer path towards a used film receptacle.

Method of peeling a bonded film from a circuit board

A laminator for bonding a film onto a substrate is disclosed which comprises a film supply plate for supplying the film along a supply path, a film temporary bonding body and a film temporary bonding edge member for temporarily bonding the film in pressing contact with the substrate. The film temporary bonding edge member is detachably provided on the film temporary bonding body. A first heat insulator is interposed between the film temporary bonding body and the film temporary bonding edge member. The temporary bonding body is detachably provided at a leading end of the film supply path of the film supply plate. A second insulator is interposed between the film supply plate and the film temporary bonding body.

Laminator

A laminator is disclosed in which a cutter unit is provided so that a cutter is moved across the direction of feed of a continuous thin film to cut off the film to a prescribed size and the film cut off by the cutter unit is laminated on a substrate. A shock absorber for absorbing a shock which takes place when the movement of the cutter of the cutter unit is stoped is provided at a prescribed portion near the stopped position of said cutter or near the prescribed portion of the body of said laminator.

A laminator for cutting a continuous thin film in a predetermined size and laminating same over a substrate is disclosed which comprises a stationary laminator body; a thin film supply member for supplying the continuous thin film to the substrate; a temporary bonding member for temporarily bonding a leading end of the continuous thin film within a pathway of thin film supply; and a support member for suppporting the thin film supply member and the temporary bonding member in such a manner that the thin film supply member and the temporary bonding member are movable toward or away from the substrate. The support member is mounted on the stationary laminator body. The laminator also includes a cutter for cutting the continuous thin film in a predetermined size. The cutter is secured to the laminator body in an area near the pathway of thin film supply between the thin film supply member and the substrate.

A device for fixing a roller to a rotary shaft, particularly useful with supply and take-up rollers in a laminator device for printed circuit boards, in which only a single tightening operation is required to fix the roller to the shaft. A support member and a press member when assembled together fit inside an end of the roller. A manually rotatable screw threaded to the press member passes through a hole in the support and presses against a sleeve through which the shaft passes and which is press-fitted inside the support member. Guide plates hold the support member and press member in place.

Apparatus for fitting rotary

A laminator for cutting a continuous thin film in a predetermined size and laminating same over a substrate is disclosed which comprises a stationary laminator body; a thin film supply member for supplying the continuous thin film to the substrate; a temporary bonding member for temporarily bonding a leading end of the continuous thin film within a pathway of thin film supply; and a support member for supporting the thin film supply member and the temporary bonding member in such a manner that the thin film supply member and the temporary bonding member are movable toward or away from the substrate. The support member is mounted on the stationary laminator body. The laminator also includes a cutter for cutting the continuous thin film in a predetermined size. The cutter is secured to the laminator body in an area near the pathway of thin film supply between the thin film supply member and the substrate.

In a thin film coating method, tack members are brought close to a surface of a substrate to temporarily tack the forward end portion of a web of thin film to the forward end of the substrate. Compression-bonding rollers are then brought into a tacking position where the forward end portion of the thin film is tacked from a standby position where the compression-bonding rollers do not touch the tack members to make compression-bonding contact with the forward end portion of the tacked thin film after the tack members are moved away from the surface of the substrate. The compression-bonding rollers are then rotated at the tacking position for the double purpose of conveying the substrate and adhering the thin film to the substrate. In this process, the forward end of the substrate is detected to produce a detection signal at a detection position before the substrate is conveyed to the tacking position, the conveyance of the substrate is stopped after the forward end of the substrate has been conveyed from the detection position to the tacking position, and the tack members are brought close to the conveyance passage of the substrate while the forward end of the substrate is being conveyed from the detection position to the tacking position to thereby tack the forward end of the thin film to the surface of the substrate after the forward end of the substrate is stopped at the tacking position.

Growing community of inventors

Tokyo, Japan

Ichio Fukuda