Oki Data Corporation

Oki Electric Industry Co., Ltd.

Nippon Telegraph and Telephone Public Corporation

Ichimatsu Abiko

Mitsuhiko Ogihara

Masaaki Sakuta

Hiroyuki Fujiwara

Shintaro Kotani

Takahito Suzuki

Yukio Tokunaga

Kazuyoshi Tateishi

Mio Chiba

Yukio Nakamura

Masumi Taninaka

Takatoku Shimizu

Rikuo Takano

Masumi Koizumi

Tsutomu Nomoto

Kazuo Tokura

Hiroshi Furuya

Yasushi Hoshino

Katsuzo Kaminishi

Hiromasa Kanno

Tomoo Araki

Susumu Chihara

Mituhiko Ogihara

Takashi Arae

Yasuo Iguti

Yichao Jiang

Hiroyuki Oki Digital Imaging Corp Fujiwara

Mitsuhiko Oki Digital Imaging Corp Ogihara

Mitsuhiko Oghihara

A semiconductor composite apparatus includes a semiconductor thin film layer and a substrate. The semiconductor thin film layer and the substrate are bonded to each other with a layer of an alloy of a high-melting-point metal and a low-melting-point metal formed between the semiconductor thin film layer and the substrate. The alloy has a higher melting point than the low-melting-point metal. The layer of the alloy contains a product resulting from a reaction of the low-melting-point metal and a material of said semiconductor thin film layer.

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost.

Semiconductor apparatus with thin semiconductor film

A combined semiconductor apparatus includes a semiconductor substrate having an integrated circuit, a planarized region formed in a surface of the semiconductor substrate, and a semiconductor thin film including at least one semiconductor device and bonded on the planarized region. A surface of the semiconductor thin film, in which the semiconductor device is formed, is disposed on a side of the planarized region. The apparatus may further include a planarized film disposed between the planarized region and the semiconductor thin film.

Combined semiconductor apparatus with semiconductor thin film

In a method of manufacturing a semiconductor thin film piece device, a plurality of semiconductor thin film pieces () are selected from among the semiconductor thin film pieces () formed on a first substrate (), and bonded to a first set of predetermined area on a second substrate (). Subsequently, a plurality of semiconductor thin film pieces are selected from the remaining semiconductor thin film pieces (), and bonded to a second set of predetermined area.

Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device

A combined semiconductor apparatus has a substrate, a thin semiconductor film attached directly or indirectly to one major surface of the substrate, and a lens attached to the opposite surface of the substrate. The thin semiconductor film includes a light-emitting element that emits light through the substrate. After passing through the substrate, the emitted light is focused by the lens. The substrate functions as a spacing element, assuring that the lens is positioned at the correct distance from the light-emitting element without the need for separate alignment. The substrate also holds the lens without the need for a separate lens holder. Driving circuitry may also be formed on the substrate.

Combined semiconductor device, LED print head, and image forming apparatus

A semiconductor apparatus includes two thin semiconductor films bonded to a substrate, and a thin-film interconnecting line electrically connecting a semiconductor device such as a light-emitting device in the first thin semiconductor film to an integrated circuit in the second thin semiconductor film. Typically, the integrated circuit drives the semiconductor device. The two thin semiconductor films are formed separately from the substrate. The first thin semiconductor film may include an array of semiconductor devices. The first and second thin semiconductor films may be replicated as arrays bonded to the same substrate. Compared with conventional semiconductor apparatus comprising an array chip and a separate driver chip, the invented apparatus is smaller and has a reduced material cost.

Combined semiconductor apparatus with thin semiconductor films

A semiconductor apparatus has a substrate to which is attached a thin semiconductor film including at least one semiconductor device. An interconnecting line links the semiconductor film with electrical circuitry on the substrate. The interconnecting line includes a pad located on the substrate, between the thin semiconductor film and the electrical circuitry. The pad, which is wider than other parts of the interconnecting line, can be used as a probe pad for testing the apparatus, and in particular for testing the electrical circuitry on the substrate before the thin semiconductor film is attached.

Semiconductor apparatus, LED print head, and printer

A semiconductor apparatus includes two thin semiconductor films bonded to a substrate, and a thin-film interconnecting line electrically connecting a semiconductor device in the first thin semiconductor film to an integrated circuit in the second thin semiconductor film. The two thin semiconductor films are formed separately from the substrate. The first thin semiconductor film may include an array of semiconductor devices. The first and second thin semiconductor films may be replicated as arrays bonded to the same substrate.

A semiconductor apparatus includes a substrate; an adhesion layer disposed on the substrate, the adhesion layer mainly consisting of semiconductor material; and at least one semiconductor thin film including at least one semiconductor device and bonded on the adhesion layer. The adhesion layer may be a polycrystalline silicon layer or an amorphous silicon layer.

Semiconductor apparatus having adhesion layer and semiconductor thin film

A peeling layer () and semiconductor thin film () are formed on a first substrate (), individual support materials () are formed thereupon, grooves () penetrating the semiconductor thin film and reaching the peeling layer () are formed in the semiconductor thin film () by etching using the individual support materials () as a mask so as to divide the semiconductor thin film () into a plurality of semiconductor thin film pieces () and form a plurality of assemblies of the semiconductor thin film pieces () and the individual support materials () fixed thereto, the semiconductor thin film pieces () are separated from the first substrate () while the individual support materials () remain fixed to the semiconductor thin film pieces (), and they are then affixed to a second substrate (). The invention facilitates handling of semiconductor thin film pieces.

Method of manufacturing a semiconductor device

A light-emitting array and its driving circuitry are integrated into a single device. The driving circuitry is formed in a semiconductor substrate and has an array of output terminals on a surface of the substrate. Organic electroluminescent elements are formed directly over the output terminals, in electrical contact with the output terminals. The electroluminescent elements are driven by direct current. An optical head assembly has one or more of these light-emitting arrays mounted on a printed circuit board.

Growing community of inventors

Tokyo, Japan

Ichimatsu Abiko