Mitsubishi Electric Corporation

Ichihiro Abe

Akiko Fujiuchi

Koichiro Okamura

Atsushi Ito

Hiroyuki Miyake

Noriyuki Komori

Hideki Kunishio

Seiichi Matsumura

Yuji Tadano

Frame for image-sensor light source

An image sensor includes: a lens configured to focus light after passing through or reflected by an object to be read and passing through a first transparent plate; a sensor arranged along the X direction and configured to receive the light focused by the lens; a first casing fixing the first transparent plate and containing or retaining the lens and the sensor; and a bracket arranged at the X direction end portion of the first casing and configured to seal the lens contained or retained by the first casing.

Image sensor including a casing to seal the optical system

An image sensor IC includes: light receiving elements disposed linearly adjacent to each other on a surface of a quadrilateral semiconductor substrate having opposite parallel sides, and disposed oblique to at least one set of opposite sides from a predetermined position on one side thereof to be opposed in the semiconductor substrate to a predetermined position on the other side thereof; and interpolation elements provided at one end portion or both end portions of the one set of opposite sides on a side of a region in which an angle formed by the linearly disposed light receiving elements and the set of opposite sides is obtuse, the interpolation elements having an oblique angle to the linearly disposed light receiving elements and receiving light on an outer side of the linearly disposed light receiving elements.

Image sensor IC having linearly and obliquely disposed light receiving elements and contact image sensor using same

The driving device includes a bendable shape memory alloy member, a resilient member for applying a tension to the shape memory alloy member in a longitudinal direction thereof, a bending member for bending the shape memory alloy member, and a movable body moved by a displacement of the shape memory alloy member. The bending member contacts the shape memory alloy member, so that the tension is applied to the shape memory alloy member in the longitudinal direction thereof. Compared with the driving device in which the shape memory alloy member is linearly disposed, the decrease in the amount of displacement can be suppressed, so that a space efficiency can be enhanced and the downsizing of the driving device can be accomplished.

Drive device

Growing community of inventors

Tokyo, Japan

Ichihiro Abe