International Business Machines Corporation

Ibrahim Murat Soganci

Bert Jan Offrein

Antonio La Porta

Folkert Horst

Jens Hofrichter

Gabriele Raino

Optically pumpable waveguide amplifier with amplifier having tapered input and output. The present invention provides for a optically pumpable waveguide amplification device that includes: a cladding material; a passive optical waveguide embedded in the cladding material that has no optical amplification functionality; and an active optical waveguide having an input portion, a middle portion and an output portion, including: a gain material with a higher refractive index than the passive optical waveguide, wherein the middle portion of the active optical waveguide is embedded in the cladding material, and faces the passive wave guide, such that a lower surface of the middle portion is an upper surface of the passive optical waveguide. There is also provided a device for optically pumpable waveguide amplification and a method for signal radiation amplification.

Optically pumpable waveguide amplifier with amplifier having tapered input and output

An apparatus includes an optical adaptor having monolithically integrated optical elements and first micro-mechanical features, the latter defining at least a first horizontal reference surface and a first vertical reference surface; wherein the first horizontal reference surface is perpendicular to an optical plane, the latter being perpendicular the optical axis of the optical elements; and wherein the first vertical reference surface is perpendicular to the first horizontal reference surface and parallel to the optical axis.

Arrangement of photonic chip and optical adaptor for coupling optical signals

An optoelectronic packaging assembly having an optical interposer and a method of same. The assembly includes a photonic and/or optoelectronic device; a planar optical interposer coupled to the photonic and/or optoelectronic device on a first side of the optical interposer and including an optical transmission element on a second side opposite to the first side; a deflecting element; and at least one optical waveguide on the first side, in-plane with the optical interposer. The waveguide is coupled at one end to the photonic and/or optoelectronic device and at another end to the deflecting element. The deflecting element is configured to enable optical transmission between the waveguide and the optical transmission element through the optical interposer. The optical interposer includes a material allowing for optical transmission between the deflecting element and the optical transmission element.

Optoelectronic packaging assembly

A method of assembling an electro-optical device is disclosed. A first unit of the electro-optical device is positioned with respect to a second unit of the electro-optical device to pre-align an optical communication pathway between the first unit and the second unit. The first unit is positioned with respect to the second unit to pre-align an electrical communication pathway between the first unit and the second unit. The first unit is bonded to the second unit to assemble the electro-optical device to establish optical communication and electrical communication between the first unit and the second unit.

Method of assembling an electro-optical device

A method for aligning optical components comprised in an optical component assembly and optical waveguides comprised in an optical waveguide assembly according to a common optical axis and by using an adapter includes providing the optical component assembly with a first alignment structure comprising a cavity designed according to the position of the optical components within the optical component assembly; providing an adapter presenting a base surface comprising a first step structure; providing the optical waveguide assembly with a second alignment structure comprising a distinct step structure designed according to the position of the waveguides within the waveguides assembly; and positioning the optical component assembly, the optical waveguide assembly and the adapter, so that a sidewall of the cavity and the distinct step structure are put in contact with a sidewall of the first step structure.

High-precision passive alignment of optical components with optical waveguides using a common adapter

An electro-optical device and method of assembly is disclosed. A first unit of the electro-optical device is positioned with respect to a second unit of the electro-optical device to pre-align an optical communication pathway between the first unit and the second unit. The first unit is positioned with respect to the second unit to pre-align an electrical communication pathway between the first unit and the second unit. The first unit is bonded to the second unit to assemble the electro-optical device to establish optical communication and electrical communication between the first unit and the second unit.

Electro-optical assembly for silicon photonic chip and electro-optical carrier

A method of manufacturing a three dimensional photonic device by two photon absorption polymerization. The method includes several stages, including direct laser writing involving polymerization by two-photon absorption to manufacture a three dimensional photonic device integrating at least two distinct micro-optical components having two optical functions and being aligned with each other so that optical signal can be transmitted from one of said distinct components to the other. The distinct components are built at a same stage of the process flow to improve their relative alignment by direct laser writing involving polymerization by two-photon absorption.

Growing community of inventors

Zurich, Switzerland

Ibrahim Murat Soganci