Advantest Test Solutions, Inc.

Ian Williams

Samer Kabbani

Karthik Ranganathan

Gregory Cruzan

Paul Ferrari

Todd Berk

Mohammad Ghazvini

Ikeda Hiroki

Kiyokawa Toshiyuki

Thomas Carleton Jones

Tom F Jones

Thomas Jones

A stand-alone active thermal interposer device for use in testing an unpackaged integrated circuit device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

Active thermal interposer device

A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

Test system including active thermal interposer device

DUT placement and handling for active thermal interposer device

Testing system including active thermal interposer device

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Huntington Beach, CA, United States of America

Ian Williams