Innovative Micro Technology

Bluechiip Limited

Bluechip Limited

Ian R Johnston

Andrew McLellan

Scott Turner

Christopher S Gudeman

John Stuart Foster

Jeffery Frank Summers

John Harley

Steven H Hovey

Duc Hau Huynh

Thanh Cong Nguyen

Phuong Duc Nguyen

Efstratios Stan Skafidas

Andrew Mclellan

A portable temperature-controlled container for receiving and housing one or more handheld carriers, each handheld carrier configured to transfer samples to and from a temperature-controlled storage environment, the handheld carrier including a handle and a tray portion, the tray portion configured to be slid into a port of a rack or tower provided in the temperature-controlled storage environment in order to withdraw a sample located in the port, the portable temperature-controlled container including a housing having an opening forming an internal cavity configured to receive one or more handheld carriers, and a lid configured to substantially close the opening, where the housing includes a recess configured to receive the handle of the handheld carrier such that closing of the lid substantially seals the internal cavity when the one or more handheld carriers are placed in the housing.

Monitoring apparatus for temperature-controlled sample collection and transport

A system is provided for transporting, handling and monitoring samples in a temperature-controlled storage environment. The system includes a handheld carrier configured to transfer samples to and from a temperature-controlled storage station and a temperature-controlled container for receiving and housing one or more carriers. The carrier includes an integrated sample identification and temperature sensing capability configured to monitor a thermal history of one or more samples during transport, handling and storage including as the samples are conveyed between the temperature-controlled storage environment and the temperature-controlled container. That is, the carrier is adapted to be held in the hand during use. A carrier for conveying and monitoring samples during transport, handling and storage is also provided.

A device for indicating violation of a temperature limit of an item is provided. The device is positionable near the item and includes a sensor configured to change its state permanently when the temperature limit is violated. The change in sensor state is machine-readable to provide a permanent indication of the temperature limit violation. The sensor includes a reservoir for storing a fluid that changes phase from a solid to a liquid when the temperature limit is violated and a channel in fluid communication with the reservoir for receiving flow of the fluid in liquid phase from the reservoir. The sensor is arranged to allow flow of the fluid in the liquid phase such that the state of the sensor is permanently changed. The sensor is further configured to prevent the fluid flow from permanently changing the sensor state until activation of the sensor from a resting state. A system and method for detecting violation of a temperature limit of an item using the device is also provided.

Device, system and method for temperature limit indication and detection of temperature-sensitive items

An optical material is inlaid into a supporting substrate, with the top surface of the optical material flush with the top surface of the substrate, wherein the optical element is used to shape a beam of light travelling substantially parallel to the top surface of the substrate, but with the central axis of the beam below the top surface of the substrate. The optical elements serve to shape the beam of light for delivery to or from a microfabricated structure within the device.

Inlaid optical material and method of manufacture

A material for bonding a first wafer to a second wafer, which includes an insulating adhesive with conductive particles embedded in the adhesive substance. When the adhesive is applied and melted or fused, and pressure is applied between the first wafer and the second wafer, the first wafer approaches the second wafer until a minimum separation is reached, defined by a dimension of the conductive particles. Each of the first wafer and the second wafer may have circuitry formed thereon, and the conductive particles may form a conductive path between the circuitry on one wafer and the circuitry on the other wafer. Advantageously, the high fusing temperature required by the insulating adhesive may also serve to activate a getter material, formed in the device cavity between the first wafer and the second wafer.

Wafer bonding material with embedded conductive particles

Growing community of inventors

Northampton, United Kingdom

Ian R Johnston