Bose Corporation

Ian M Collier

Kevin Paul Annunziato

Michael J Monahan

Eric Matthew Wallace

Ryan Christopher Silvestri

Roman Sapiejewski

Jason Harlow

William W Tice

Michael E Laude

Kevin M Krauss

Julie E Tierney

David H Pitcher

Pericles Nicholas Bakalos

Tetsuro Oishi

Jason M Harlow

A positioning and retaining structure for an in-ear earpiece. An outer leg and an inner leg are attached to each other at an attachment end and attached to a body of the earpiece at the other end. The outer leg lies in a plane. The positioning and retaining structure have a stiffness that is greater when force is applied to the attachment end in a counterclockwise direction in the plane of the outer leg than when force is applied to the attachment end in a clockwise direction in the plane of the outer leg. The positioning and retaining structure position an earpiece associated with the earpiece in a user's ear and retains the earpiece in its position.

Earpiece positioning and retaining

A headphone includes a housing defining an enclosed volume, an electro-acoustic transducer dividing the enclosed volume into a front volume and a rear volume, a first port in the housing coupling the front volume to an ear canal of a user, a second port in the housing coupling the front volume to space outside the ear, a third port in the housing coupling the rear volume to space outside the ear, and an ear tip configured to surround the first port and seal the ear canal from space outside the ear. The second port has a diameter and a length that provide an acoustic mass with an acoustic impedance with a high reactive component and a low resistive component.

Earphones

A headphone includes an acoustic transducer having a sound-radiating surface that moves along a first axis, a housing enclosing the acoustic transducer, a first acoustic chamber defined by a first side of the acoustic transducer and a first portion of the housing, the first acoustic chamber including a first reactive port in a serial configuration with an acoustic resistance to couple the first acoustic chamber with space outside the headphone, a second acoustic chamber defined by a second side of the acoustic transducer and a second portion of the housing, the second acoustic chamber separated from the first acoustic chamber by the acoustic transducer, and an opening coupling the second acoustic chamber to the wearer's ear canal along a second axis that is not parallel to the first axis.

A positioning and retaining structure for an in-ear earpiece. An outer leg and an inner leg are attached to each other at an attachment end and attached to a body of the earpiece at the other end. The outer leg lies in a plane. The positioning and retaining structure have a stiffness that is greater when force is applied to the attachment end in a counterclockwise direction in the plane of the outer leg than when force is applied to the attachment end in a clockwise direction in the plane of the outer leg. The positioning and retaining structure position an earpiece associated with the earpiece in a users ear and retains the earpiece in its position.

An earphone includes a first acoustic chamber having a reactive element and a resistive element in a parallel configuration, a second acoustic chamber separated from the first acoustic chamber by an acoustic transducer and including a unitary port to provide both pressure equalization of the second chamber and equalization of the earphone to a predetermined frequency response, and a housing to support the apparatus from the concha of a wearer's ear and to extend the second acoustic chamber into the ear canal of the wearer's ear.

Equalized earphones

A headset including an earcup having a front opening adapted to be adjacent to the ear of the user, a baffle disposed within the earcup to define front and rear cavities, a cushion extending around the periphery of the front opening of the earcup and constructed and arranged to accommodate the ear of the user, the cushion having a first density, an inner radial portion, and an outer radial portion opposite the inner radial portion, a cushion cover substantially surrounding the cushion to form a headphone cushion assembly, and a high impedance component having a second density and located near the outer radial portion to increase the transmission loss of the cushion along a radial direction.

Growing community of inventors

Los Angeles, CA, United States of America

Ian M Collier