Taiwan Semiconductor Manufacturing Comp. Ltd.

Holtek Semiconductor Corp.

Ian Hsieh

Che-fu Chen

Yan-Hong Liu

Jason Tsai

Yan-hong Liu

The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber, a chuck housed in the chamber and configured to hold a substrate, and a control device configured to control a translational displacement and a rotation of the chuck. The chuck can include a passage extending along a periphery of the chuck and dividing the chuck into an inner portion and an outer sidewall portion, and a first multiple of openings through the outer sidewall portion of the chuck and interconnected with the passage. The passage can be configured to transport a fluid. The first multiple of openings can be configured to dispense the fluid.

Semiconductor cleaning apparatus and method

The present disclosure describes an apparatus. The apparatus includes a chuck for placing an object thereon, a gas passage extending along a periphery of an outer sidewall of the chuck and separating the chuck into an inner portion and a sidewall portion, and a plurality of gas holes through the sidewall portion and configured to connect a gas external to the chuck to the gas passage.

Electrostatic chuck sidewall gas curtain

The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber with the chuck-based device configured to clean the chamber, a loading port coupled to the chamber and configured to hold one or more wafer storage devices, and a control device configured to control a translational displacement and a rotation of the chuck-based device. The chuck-based device can include a based stage, one or more supporting rods disposed at the base stage and configured to be vertically extendable or retractable, and a padding film disposed on the one or more supporting rods.

Methods for cleaning semiconductor device manufacturing apparatus

A encoding/decoding method and device for a remote controller utilizing a baud rate to encrypt data for transmission. The encoding device includes an encoder encoding an identification code into an encrypted code; and an interpreter interpreting the un-encoded portion of the identification code and the encrypted code into a transmission signal. When the encrypted code is in a first base, the plain code corresponding to the encrypted code will be transmitted with a first baud rate; and when the encrypted code is in a second base, the plain code corresponding to the encrypted code will be transmitted with a second baud rate. The decoding device includes a receiver receiving the transmission signal; a interpreter connected to the receiver interpreting the transmission signal into a received signal; an encoder utilizing the same encoding algorithm as in the transmitter to generate a comparison code; and a processor comparing the received signal and the comparison code.

Baud rate modulation encoding/decoding method and device for remote controller

A signal transceiver for transmitting a carrier signal to a transponder and receiving a modulated data signal returned by the transponder is provided. The signal transceiver includes a transistor with a base, a collector and an emitter, a controller being electrically connected to the base and providing a controlling signal for turning on the transistor, an oscillation source being electrically connected to the collector for providing the carrier signal, a capacitor being electrically connected to the base and the oscillation source for forming an oscillation circuit, and a resonator being electrically connected to the collector for transmitting the carrier signal to the transponder and receiving the modulated data signal returned by the transponder, and outputting a demodulated data signal through the emitter.

Growing community of inventors

Hsinchu, Taiwan

Ian Hsieh