Liebert Corporation

Delta Design, Inc.

Cooligy, Inc.

Vertiv Corporation

Ian G Spearing

Timothy J Schrader

Lewis S Wayburn

Tim Schrader

Girish Upadhya

Mark McMaster

Paul Tsao

Douglas E Werner

Norman Chow

Derek E Gage

Frederic Landry

Mark Munch

Terry Craps

Cynthia M Barnes

John D Ruth

Carl Caldwell

Charles R Schmidt, Jr

Matthew F W Brown

Charles M Mahaffey

Todd C Sharpley

John E Voshell

A power distribution cabinet is disclosed which includes multiple internal compartments for separating and channeling hot air generated by high heat generating components out of the cabinet without coming into contact with more heat sensitive components. The cabinet includes a baffle structure which forms an internal wall within the cabinet, which helps to form a high heat compartment and an upper compartment. The high heat compartment houses a heat generating component. Cool air is allowed to flow into a lower area of the cabinet and into the high heat compartment, and is also channeled into the upper compartment where at least one other heat generating component is located. The baffle structure channels hot air formed within the high heat compartment out toward a rear area of the equipment cabinet, while also helping to channel warm air created within the upper compartment through a top panel of the cabinet.

Airflow channel power distribution equipment cabinet

The disclosure provides systems and methods for regulating and distributing cooling fluid through a plurality of heat sinks, such as cold plates, using a flow regulator, which sets the total flow rate, in combination with one or more individual orifices that allow further flow distribution as required by individual cold plates, despite flow variations upstream of the orifices. An orifice can be coupled to an orifice holder, which includes a body to support the orifice, and which may be coupled (directly or indirectly) to an inlet of the cold plate. Alternative manners of coupling orifices in the fluid flow besides an orifice holder can be employed. Generally, the flow regulator(s) is coupled with a plurality of orifices and conduits through which the cooling fluid flows. Related system components can be assembled as a module for installation into a cooling system that includes other system components such as a pump, compressor or other pressure sources for the cooling fluid.

Cooling fluid flow regulation distribution system and method

A heat exchanger can have a manifold which includes a plurality of laminated sheets that allow a customization of the heat exchanger. The design can allow for a more optimal flow of coolant to areas of high load, thereby making the temperature distribution across the heat exchanger more uniform, or intentionally non-uniform. Furthermore, the laminated sheets can allow multiple circuits to be employed in the heat exchanger such that different coolants can be utilized therein and maintained separate from one another. The tubes can be microchannel tubes. A single set of manifolds can be used with multiple heat exchanger cores to provide a more compact heat exchanger. Mounting features can be integral with a group of the sheets.

Laminated sheet manifold for microchannel heat exchanger

A cooling system is provided that comprises: a refrigerant loop having a pump; an evaporator heat exchanger thermally coupled to a heat source, the evaporator plumbed in the loop; a condensing heat exchanger and a receiver plumbed in the loop; and an equalizing conduit plumbed between an inlet to the condenser and the receiver and comprising a flow regulating valve.

Method and apparatus for equalizing a pumped refrigerant system

Mounting systems are provided for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from an electronics server. An engaging force is applied to the two heat exchangers to create thermal communication there between. A mounting mechanism is configured to isolate the engaging force applied to the two heat exchangers. The mounting mechanism may include an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server to lessen the possibility of disconnecting the electrical connections between the electronics server and the rack, and/or lessening mechanical stresses transferred to the electronics server and the rack chassis. The mounting mechanism also may be coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact.

Liquid cooling systems for server applications

A system and control method mitigates hysteresis of an adjustable component in the system. A control module can allow small control changes to be effected to the component within limits of the component's and/or the system's normal hysteresis band. The control method can allow finer, more accurate and more aggressive control to be obtained from the component. The system and method can utilize two separate control regimes to control adjustments to the component. The first control regime can control changes larger than a hysteresis band and/or changes in a same direction as the last adjustment that was performed with the first control regime. The first control regime can be a feedback-based adjustment to the component. The second control regime can be utilized to control changes within the hysteresis band. The second control regime can use open-loop based adjustments to the component.

Hysteresis mitigation and control method

The present disclosure describes swivel hinge assemblies for use in rotatably mounting two structures together, such that the structures are in fluid communication by way of fluid flow, as well as systems including such hinge assemblies. The swivel hinge assemblies generally comprise a fluid inlet port, a fluid outlet port, shafts surrounding the inlet and outlet ports and allowing for rotation about one or more axes, and attachment means which may be integrally formed with the shafts of the hinge assembly. In use, these assemblies eliminate the use for secondary hinges or secondary mounting hardware in attaching a door and a structure together in order to maintain fluid communication between an electronics rack and a heat exchanger mounted on the door of an electronics rack.

Integral swivel hydraulic connectors, door hinges, and methods and systems for their use

A system of cooling and method of use that includes a connector having a data reader capable of reading a wireless identifier and/or a breaker box capable of routing liquid cooling to at least one server. In a preferred embodiment, both the quick connector and the breaker box are used in conjunction with a liquid coolant such as refrigerant or water.

Cooling system and method of use

Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

Liquid cooling loops for server applications

A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

An apparatus and method for controlling the temperature of an electronic device under test utilizes a thermal head spaced apart from a movable support structure by a mechanical isolation assembly. The support structure has a manifold configured to route refrigerant fluid between the evaporator head and components of a refrigeration system. The mechanical isolation assembly is configured to compensate for variations in the planar orientation of the device under test. Moreover, the mechanical isolation assembly preferably includes bellows through which the refrigerant fluid is conducted.

Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test

An apparatus for controlling the temperature of an electronic device. The apparatus comprises a refrigeration system including a compressor and a multi-pass heat exchanger. The refrigeration system is operative to circulate a refrigerant fluid through a fluid flow loop such that the refrigerant fluid will change between gaseous and liquid states to alternately absorb and release thermal energy. The refrigerant fluid is pre-cooled in the heat exchanger by a pre-cooling refrigerant stream. A thermal head is connected into the fluid flow loop and has a temperature controlled surface.

Apparatus and method for controlling the temperature of an electronic device

An apparatus for controlling the temperature of an electronic device under test includes a thermal head. The thermal head defines a flow channel for passage of a refrigerant fluid so as to cause transfer of thermal energy between the electronic device and the thermal head. A refrigeration system is connected in fluid communication with the flow channel of the thermal head to supply refrigerant fluid thereto. An inlet valve and outlet valve are provided to facilitate disconnection of the thermal head from the refrigeration system. The valves are sequentially closed with the refrigeration system continuing to operate during the interim period so as to reclaim the refrigerant fluid. Accordingly, thermal head may be disconnected from refrigeration system and removed.

Growing community of inventors

Lexington, SC, United States of America

Ian G Spearing