Nordson Corporation

Ge Inspection Technologies, Gmbh

Ian Christopher Mayes

Martin Bugg

David T Lilley

Robert Brian Deards

Xiaoyu Qiao

John Hansen

Alan Daly

A bond test apparatus includes a test tool, a stage for mounting a bond for testing, and a drive mechanism comprising a voice coil. The voice coil is coupled to either the stage or to the test tool and is configured to provide relative movement between the stage and the test tool such that the bond applies a test force to the test tool. The bond test apparatus can also include a velocity sensor configured to sense an instantaneous relative velocity between the stage and the test tool, and a controller configured to control the drive mechanism in response to a signal from the velocity sensor. The bond test apparatus can also include a retarding mechanism coupled to the stage or the test tool and configured to apply, in response to relative movement between the stage and the test tool, a retarding force opposing the driving force.

Bond test apparatus and method for testing the strength of bonds on electrical circuitry

A cartridge suitable for use in a bond testing machine includes a plurality of a different test tools. A rotary mechanism is provided and each of the plurality of different test tools is mounted to the rotary mechanism angularly spaced from one another. A drive unit is coupled to the rotary mechanism and is configured to rotate the rotary mechanism to move each of the plurality of different test tools to and from a use position. An air interface receives compressed air from a corresponding air interface on a positioning assembly of the bond testing machine.

Bond testing machine and cartridge for a bond testing machine comprising a plurality of test tools

A method of detecting defects using eddy currents is disclosed. The method comprises:

Method and apparatus for phase sensitive detection of eddy current measurements

Growing community of inventors

Ampthill, United Kingdom

Ian Christopher Mayes