Honeywell International Inc.

Ian Charles Baron

Sebastien Tixier

Michael Kon Yew Hughes

Johan Backstrom

Sudhir Thalore

Iouri Markevitch

Tal Katz

Mayank Kalra

A dual-optical displacement sensor system includes a scanner including a first and second scanner head including optical displacement sensors providing a first and second beam having a first optical axis (OA) and a second OA. A computing device or programmed circuit is coupled to receive time versus position data from measurements involving alignment target(s) including at least one knife edge pair including a first and second knife edge oriented in a first plane of the alignment target that is essentially perpendicular to the OAs positioned between the scanner heads for interacting with the beams, and implement at least one equation to analyze the data for determining a degree of alignment of the first and second OA. Using the degree of alignment, an algorithm is for automatic alignment of the OAs or assist instructions for a user alignment of the OAs that provides guiding steps for the user for the alignment.

Dual-optical displacement sensor alignment using knife edges

An apparatus includes a transmitter configured to transmit a signal including an electromagnetic pulse towards material in a tank. The apparatus also includes a receiver configured to receive a signal including multiple reflections of the pulse. The apparatus further includes at least one processing device configured to process the received signal and determine a measurement associated with the material in the tank. To process the received signal, the at least one processing device is configured to fit multiple models onto the received signal, select one of the models, identify at least one of the multiple reflections in the received signal using the selected model, and determine the measurement using the at least one identified reflection in the received signal. Each model is constructed from a superposition of multiple types of pulse reflections.

Apparatus and method for measuring thin material thicknesses in inventory management applications

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Vancouver, Canada

Ian Charles Baron