Viasat, Inc.

Ian A Cleary

Ramanamurthy V Darapu

Kenneth V Buer

David H Irvine

Clifford K Burdick

Philip A Lampe

Timothy M Beck

Methods, systems and devices for use in semiconductor package manufacture of a package having a die and die substrate are provided. A method for use in semiconductor package manufacture includes steps of forming one or more wirebond interconnections between the die and the die substrate, capturing input data representative of wirebond interconnection features during inspection of the formed wirebond interconnections, and passing the captured input data to a machine learning (ML) engine. The method further includes processing the captured input data with the machine learning engine using a trained model to obtain an output array of data, evaluating the output array of data to determine a predicted radio-frequency (RF) performance rating, and outputting the predicted RF performance rating. Training data set processing may include applying image data and parameters to a multi-layer neural network to obtain a set of candidate ML models, and selecting an optimal ML model.

Semiconductor package inspection with predictive model for wirebond radio frequency performance

Described techniques and apparatuses relate to determining an attenuation environment surrounding a satellite terminal in a satellite communication system. The satellite terminal may receive signals from an auxiliary satellite system, and determine aspects of an attenuation environment that may affect communications with a communications satellite system. For example, transmissions from an auxiliary satellite system may be associated with a respective location of the transmitting satellite in order to define an attenuation profile for the satellite terminal antenna assembly. Subsequent signals from the auxiliary satellite system may be compared with the attenuation map, and the comparison may be used to identify a diagnostic condition for communications with a communications satellite system. In some examples the comparison of signals to the attenuation profile may indicate an obstruction between the satellite terminal antennas and a communications satellite, or a misalignment of a satellite terminal antenna assembly.

Determining an attenuation environment of a satellite communication terminal

The described features generally relate to determining dynamic signal quality criteria for an installation of satellite terminals for communications in a satellite communications system. In particular, the signal quality criteria for an installation may be based on an identified position of the satellite terminal to be installed, and in some examples based on the positions and signal characteristics of neighboring satellite terminals that have already been installed. In some examples, a signal quality map may be generated for a service beam coverage area, based on predetermined transmission characteristics and/or measured transmissions from a number of satellite terminals served by a communications satellite. The generated signal quality map may then be used to determine a signal quality threshold for the installation of a satellite terminal being installed for communications in a satellite communications system.

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Tempe, AZ, United States of America

Ian A Cleary