Unimicron Technology Corporation

Other

I-Ta Tsai

Shih-Ping Hsu

Chien-Chih Chen

Yu-Shen Chen

Tsung-Hsin Tsai

An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

Embedded component structure and manufacturing method thereof

An air cleaning device using water as a filter comprises a water tank, a water pump, a pressure equalizer and air-inhale tubes. The water tank includes an accommodation space for containing water, air inlets and air outlets. A cover hoods the water tank and has a water storage tank and air inlets. The water pump is disposed inside the water tank and connected with the pressure equalizer. Jet pipes of the pressure equalizer respectively interconnect with the air inlets through the air-inhale tubes. The water pump sucks the water in the accommodation space. Through the air-inhale tubes, the jet pipes inhale air in a jet fashion from exterior of the air inlets disposed in multiple directions. The air cleaning device can filter out the impurities in the air and fast clean the air of a large space. The present invention uses water as the filter and favors environmental protection.

Air cleaning device using water as filter

A package structure having an embedded semiconductor component, includes: a chip having an active surface with electrode pads and an inactive surface opposite to the active surface; a first insulating protection layer having a chip mounting area for the chip to be mounted thereon via the active surface thereof; a plurality of connection columns disposed in the first insulating protection layer at positions corresponding to the electrode pads and electrically connected to the electrode pads via solder bumps; an encapsulant formed on one surface of the first insulating protection layer having the chip mounted thereon for encapsulating the chip; and a built-up structure formed on the other surface of the first insulating protection layer and the connection columns. Due to the bending resistance of the encapuslant, the warpage of the built-up structure is prevented.

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Kaohsiung, Taiwan

I-Ta Tsai