Qisda Corporation

Prior Company Limited

I-Ling Chen

Yi-Cheng Kuo

Cheng-Hsin Tsai

Yu Lin Huang

A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1):  in Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.

Thermosetting resin composition and prepreg

A backlight module including a first casing, a light guiding member, a light source and a limiting structure is provided. The first casing has a top portion and a first side portion connected to the top portion. The light guiding member is located at an inner side of the first side portion and has a light incident surface and a top surface. The light source is located at the inner side of the first side portion and is disposed adjacent to the light guiding member. The light source has a light emitting surface facing the light incident surface. The limiting structure is protruded from a wall below the top portion and located above at least part of the light source and at least part of the top surface of the light guiding member.

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Taipei, Taiwan

I-Ling Chen