Chicony Electronics Co., Ltd.

I-Heng Chen

Chung-Yao Lin

Yu-Hsiu Lin

A covering structure including a bottom covering layer, a top covering layer, and a thermoplastic material layer is disclosed. The thermoplastic material layer is laminated between the bottom covering layer and the top covering layer. The thermoplastic material layer includes a first thermoplastic material layer part and a second thermoplastic material layer part that are connected to each other. The first thermoplastic material layer part has a first thickness. The second thermoplastic material layer part has a second thickness. The first thickness is larger than the thickness of the top covering layer. The first thickness is 4&#x2dc;7 times of the second thickness. The disclosure further discloses an input device using the covering structure and a manufacturing method of the covering structure.

Growing community of inventors

Taipei Hsien, Taiwan

I-Heng Chen