Taiwan Semiconductor Manufacturing Comp. Ltd.

I-Han Huang

Fu-An Wu

Jung-Ping Yang

Chia-En Huang

Chih-Chieh Chiu

Cheng Hung Lee

Hong-Chen Cheng

Chun-Jiun Dai

Chih-Hao Wang

Kuo-Cheng Chiang

Shi Ning Ju

Cheng-Hung Lee

Wen-Ting Lan

Hsiao-Lan Yang

Ming-Yi Lee

Yi-Hung Tsai

A method of manufacturing a semiconductor device structure includes bonding a device substrate to a first de-bond layer. The first de-bond layer is disposed on a first carrier substrate, and the device substrate has a first side facing the first carrier substrate and a second side opposite from the first side. The device substrate has a first width. A front-end-of-line (FEOL) process and a back-end-of-line (BEOL) process are performed on the device substrate. A second carrier substrate having a second de-bond layer is bonded on the second side of the device substrate. The first carrier substrate is removed by removing the first de-bond layer. A width of the device substrate remains the first width after removing the first carrier substrate.

Trim free wafer bonding methods and devices

An integrated circuit includes a memory cell array, a row decoder configured to generate a first decoder signal, a column decoder configured to generate a second decoder signal, and an array of write assist circuits coupled to the row and column decoder and the memory cell array. Each write assist circuit is configured to set an operating voltage of a corresponding memory cell, and generate the output signal in response to a first control signal. The operating voltage corresponds to an output signal. Each write assist circuit includes an AND gate coupled to a programmable voltage tuner. The programmable voltage tuner includes a set of P-type transistors coupled to a first P-type transistor. The set of P-type transistors is coupled together in parallel, and receives a set of select control signals. A first terminal of the first P-type transistor is configured to receive an AND signal from the AND gate.

Three-dimensional (3-D) write assist scheme for memory cells

An integrated circuit includes an array of write assist circuits electrically connected to a memory cell array. Each write assist circuit is configured to set an operating voltage of a corresponding memory cell. Each write assist circuit is configured to receive at least a first control signal, and generate an output signal at least in response to the first control signal. The output signal controlling the operating voltage of the corresponding memory cell. Each write assist circuit includes a programmable voltage tuner. The programmable voltage tuner includes a first P-type transistor and a second P-type transistor coupled to the first P-type transistor. A first terminal of the first P-type transistor is configured as a first input node to receive a first select control signal. A first terminal of the second P-type transistor is configured as a second input node to receive a second select control signal.

An integrated circuit that includes an array of memory cells and an array of write logic cells. The integrated circuit also includes a write address decoder comprising a plurality of write outputs. The array of write logic cells is electrically connected to the plurality of write outputs. The array of write logic cells is electrically connected to the array of memory cells. The array of write logic cells is configured to set an operating voltage of the memory cells.

A voltage providing circuit includes a first circuit configured to receive a first input signal and a second input signal and to generate an output signal. The first circuit includes a first transistor configured to switchably couple the second input signal to a first node responsive to the first input signal, a second transistor having a gate terminal coupled with the first node, and a third transistor having a source terminal coupled with a source terminal of the second transistor. The third transistor is configured to set a reference voltage value at the source terminal of the second transistor if the first input signal indicates that the second input signal is pulled from a first voltage value toward a second voltage value and if the second input signal reaches a predetermined voltage value. A second circuit is configured to receive the output signal and to generate an output voltage.

Voltage providing circuit

A circuit includes a tracking bit line, a first capacitive circuit, a tracking circuit and a detection circuit. The first capacitive circuit is coupled to the tracking bit line. The first capacitive circuit has a capacitive load on the tracking bit line. The tracking circuit is coupled to the tracking bit line. The tracking circuit being configured to charge or discharge a voltage on the tracking bit line based on a first control signal or the capacitive load. The detection circuit is coupled to the tracking bit line, and is configured to generate a SAE signal responsive to the voltage of the tracking bit line and an inverted first control signal.

Circuit and method of generating a sense amplifier enable signal

A circuit includes a tracking bit line, a tracking unit connected to the tracking bit line and a detection unit. The tracking unit is configured to receive a first control signal and configured to selectively charge or discharge a voltage on the tracking bit line in response to the first control signal. The detection unit is coupled to the tracking bit line and configured to generate a sense amplifier enable (SAE) signal in response to the voltage level on the tracking bit line.

Circuit to generate a sense amplifier enable signal

A memory includes a plurality of bit cells. Each bit cell includes a bit line and a storage cell coupled to the bit line. A header PMOS transistor is coupled to the storage cell in each bit cell. The header PMOS transistor is at least partially turned off during a write operation by a header control signal.

Memory with bit cell header transistor

One or more techniques or systems for designing a cell are provided. The cell generally includes one or more transistors, such as a pass gate transistor, a pull up transistor, or a pull down transistor, respectively associated one or more gate to gate distances. In some embodiments, a second gate to gate distance is selected based on a first gate to gate distance. For example, the first gate to gate distance and the second gate to gate distance are associated with a first transistor. In another example, the first gate to gate distance is associated with a first transistor and the second gate to gate distance is associated with a second transistor. In this manner, a cell design is provided to improve a static noise margin (SNM) or a write margin (WM) for the cell, for example.

Cell design

A wake up circuit includes a bias signal control block configured to receive a sleep signal and to generate a plurality of bias control signals. The wake up circuit further includes a bias supply block configured to receive each bias control signal of the plurality of bias control signals and to generate a header bias signal. The bias supply block includes a first bias stage configured to receive a first bias control signal of the plurality of bias control signals, and to control the header bias signal to be equal to a first voltage. The bias supply block further includes a second bias stage configured to receive a second bias control signal of the plurality of bias control signals, and to control the header bias signal to be equal to a second voltage different from the first voltage. The wake up circuit further includes a header configured to receive the header bias signal, and to selectively connect a supply voltage to a load based on the header bias signal.

Wake up bias circuit and method of using the same

A voltage providing circuit includes a first circuit, a second circuit coupled with the first circuit, and a third circuit coupled with the second circuit. The first circuit is configured to receive a first input signal and to generate a first output signal. The second circuit is configured to receive the first input signal and the first output signal as inputs and to generate a second output signal. The third circuit is configured to receive the second output signal and to generate an output voltage.

A method comprises identifying a number of power domains in a device, connecting the power domains to each other by a number of control devices during a wake-up mode of the device, and disconnecting the power domains after the wake-up mode of the device.

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Tainan, Taiwan

I-Han Huang