Seagate Technology Incorporated

I-Fei Tsu

Javier Ignacio Guzman

Michael J Conover

Dimitar Velikov Dimitrov

Michael C Kautzky

Declan Macken

Jumna P Ramdular

Sunita B Gangopadhyay

Sisavath M Bounnakhom

Joseph J Schobel

Robert W Lamberton

A system includes a computing device with circuitry and memory with instructions for execution by the circuitry. The instructions include monitoring signals indicative of a non-uniform distance between a transfer head and a receiving substrate, and, in response to the monitored signals, actuating one or more actuators towards the transfer head or the receiving substrate to deform the transfer head or the receiving substrate.

Micro-component transfer systems, methods, and devices

A method for transferring components from a transfer head to a receiving substrate is disclosed. The method includes monitoring signals indicative of a pitch mismatch between locations on the transfer head and locations on the receiving substrate and actuating at least one actuator based at least in part on the monitored signals to reduce the mismatch of the pitch of the locations on the transfer head and the locations on the receiving substrate.

Micro-component batch transfer systems, methods, and devices

A read/write head with a bottom shield on a slider substrate and a shared shield spaced apart from the bottom shield. A write head is deposited on the shared shield. A read sensor is spaced apart by reader magnetic gaps from the bottom shield and the shared shield. Electrically insulating layers in the reader magnetic gaps form a thermal resistance between the read sensor and the shields. A thermally conducting nonmagnetic layer in a reader magnetic gap reduces the thermal resistance without a corresponding reduction in the reader magnetic gaps.

Non-magnetic metallic layer in a reader gap of a disc drive

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Chanhassen, MN, United States of America

I-Fei Tsu