Phoenix Precision Technology Corporation

Other

I-Chung Tung

Shih-Ping Hsu

Han-Kun Hsieh

Shing-Ru Wang

Jiun-Shian Yu

Kuo-Bin Chen

Duncan Yu

Tzu-Li Li

A method of fabricating electroplate solder on an organic circuit board for forming flip chip joints and board to board solder joints is disclosed. In the method, there is initially provided an organic circuit board including a surface bearing electrical circuitry that includes at least one contact pad. A solder mask layer that is placed on the board surface and patterned to expose the pad. Subsequently, a metal seed layer is deposited by physical vapor deposition, chemical vapor deposition, electroless plating with the use of catalytic copper, or electroplating with the use of catalytic copper, over the board surface. A resist layer with at least an opening located at the pad is formed over the metal seed layer. A solder material is then formed in the opening by eletroplating. Finally, the resist and the metal seed layer beneath the resist are removed.

Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints

A method for fabricating a core circuit board having passive components, such as resistors, capacitors and inductors, is disclosed, which can be used to construct a multilayer circuit board having embedded passive components. In making such as a core circuit board, a resistive film which is a continuous or non-continuous is first formed on one side of a conductive foil. Two such conductive foils are laminated onto a high dielectric layer. The electrodes for various passive components or spiral coils for the inductive components and electrical circuit pattern are finally made on the same conductive foils simultaneously. Finally, a core circuit board having passive components for further making a multilayer circuit board is thus constructed.

Method for making a multilayer circuit board having embedded passive components

Disclosed is a method of preparing a thin core substrate for fabricating a build-up multilayer circuit board. The method involves the use of an insulating layer which is covered with the electrically conductive sheets. The openings are made in the electrically conductive layers at the predetermined positions, where the vias are also formed in the insulating layer. An electrically conductive layer is deposited to cover the vias. After the electrically conductive sheets and layer are patterned, a thin core substrate is constructed. The build-up layers are then made at least one side of the thin core substrate to form a build-up multilayer circuit board.

Thin core substrate for fabricating a build-up circuit board

A pin attachment method for mounting the pins on a wiring substrate for fabricating a pin grid array package is disclosed. There is provided an organic wiring board including a surface bearing electrical circuitry which includes at least one contact pad for receiving a pin. A solder mask layer which is placed on the board surface and patterned to expose the pad. The solder mask layer which does not cover any portion of the pad and forms a well by the perimeter of the solder mask layer around the pad. Subsequently, a pin and a solder material which are placed over said pad in the well. The pin which is soldered to the pad by a temperature sufficient to melt the solder material.

Pin attachment by a surface mounting method for fabricating organic pin grid array packages

A stiff heat spreader element for making a cavity down plastic chip carrier having benefits of excellent heat dissipation property, low weight, small thickness, low warpage and low twist is disclosed. The stiff heat spreader element is formed by bonding a heat spreader and a thermally conductive sheet with using a first bonding sheet. The first bonding sheet is a prepreg or prepregs made of fiber-reinforced resin. A second bonding sheet is used to bond a circuit substrate and the stiff heat spreader element. The second bonding sheet is made of a single adhesive layer or a stack of adhesive layers. The adhesive layer is made of an adhesive material, or a flake-filled adhesive material, or short fiber-filled adhesive material, or a particle-filled adhesive material. The second bonding sheet is not a prepreg or prepregs. The circuit substrate has an opening to receive an electronic chip.

Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier

A method which includes a flashing process and a process for extruding thermoplastic plastics is provided for achieving more thorough devolatilizing of the solutions of thermoplastic plastics, to ensure that the solutions of thermoplastic plastics are able to be worked continually, wherein the accoustic treatments are introduced into both processes to increase the efficiency of removing volatile components and thus leads to the decrease of the processing time for extruding thermoplastic plastics. In the flashing process, the ultrasonic horns are arranged to scatter the feed stream of the solution which increases the devolatilizing surface of the polymer fluid and, simultaneously, to enhance bubble formation and produce strong agitation in the polymer fluid, thereby increasing the devolatilizing efficiency. In the process of extruding thermoplastic plastics, the ultrasonic horns are arranged in the extruder to enhance both formation and rupture of bubbles, thereby increasing the devolatilizing efficiency.

Growing community of inventors

Hsinchu, Taiwan

I-Chung Tung