Taiwan Semiconductor Manufacturing Comp. Ltd.

I-Chun Hsu

Wen-Chih Chiou

Tsang-Jiuh Wu

Yung-Chi Lin

Chia-Yin Chen

Yang-Chih Hsueh

Yan-Zuo Tsai

Provided are a semiconductor device and a method for manufacturing the same, and a semiconductor package. The semiconductor device includes a die stack and a cap substrate. The die stack includes a first die, second dies stacked on the first die, and a third die stacked on the second dies. The first die includes first through semiconductor vias. Each of the second dies include second through semiconductor vias. The third die includes third through semiconductor vias. The cap substrate is disposed on the third die of the die stack. A sum of a thickness of the third die and a thickness of the cap substrate ranges from about 50 μm to about 80 μm.

Growing community of inventors

Hsinchu, Taiwan

I-Chun Hsu