Chunghwa Picture Tubes, Ltd.

Htc Corporation

I-Cheng Shih

Ming-Tan Hsu

Tai-Ming Lin

Jung-Chieh Cheng

Ke-Horng Chen

Yuan-Tung Chen

Jyun-Jhong Lin

Chih-Chien Chen

Tzung-Ling Tsai

Su-Kang Chou

An object tracking method includes following steps: transmitting search information for searching for an object by a first processor during a search stage; receiving the search information and using a second processor to determine whether any of at least one accessory camera has captured an object image in the search stage. When the second processor determines that at least one of the at least one accessory camera has captured the object image, the second processor transmits notification information to the first processor and the first processor enters a tracking stage and transmits request information to the second processor. When the second processor receives the request information, the second processor performs one of the following: transmitting the object image to the first processor, wherein the first processor calculates an object pose according to the object image.

Object tracking system and object tracking method

The present invention provides a bonding structure of circuit substrates for instant circuit inspecting. The connecting wire design of the bonding structure has an instant inspection ability of circuit connection in bonding two circuit substrates. In two bonded circuit substrates, the signal inputted at the circuit part passes the conductive particles to the first connecting wire, and then passes the conductive particles again to the detecting part from the first connecting wire. Therefore, measuring the output signal can inspect the reliability of the circuit connection of the bonded circuit substrates. If the output signal is the same as the input signal, the bonding structure between the first connecting wire and the circuit part is validated, or, if not, the bonding structure is invalidated.

Bonding structure of circuit substrate for instant circuit inspecting

The present invention provides a bonding structure of circuit substrates and an instant circuit inspection method thereof. The contact pad design of the bonding structure has an instant inspection ability of circuit connection in bonding two circuit substrates. In two bonded circuit substrates, the signal inputted at the circuit part passes the conductive particles to the first contact pad, and then passes the conductive particles again to the detecting part from the first contact pad. Therefore, measuring the output signal can inspect the reliability of the circuit connection of the bonded circuit substrates. If the output signal is the same as the input signal, the bonding structure between the first contact pad and the circuit part is validated, or, if not, the bonding structure is invalidated.

Bonding structure of circuit substrate and instant circuit inspection method thereof

A circuit and a method for driving pixels of an organic light-emitting display are provided. The circuit comprises a thin-film transistor having a source terminal connected to a voltage source, a storage capacitor having a first terminal connected to a gate terminal of the thin-film transistor, and an organic light-emitting diode having a cathode connected to a ground. The gate terminal and a drain terminal of the thin-film transistor are connected in a clamping phase and a reverse phase. A second terminal of the storage capacitor is connected to the ground in the clamping phase, and is connected to a data line in a light-emitting phase and in the reverse phase. An anode of the organic light-emitting diode is connected to the drain terminal of the thin-film transistor in the light-emitting phase and in the reverse phase.

Method for driving pixels of an organic light emitting display

An organic electro-luminescence display apparatus including a substrate, data lines and scan lines, a plurality of first, second and third organic electro-luminescence units, at least one first source driver, second source driver and third source driver and a gate driver is provided. Data lines and scan lines are disposed on the substrate to define a plurality of pixel areas. Each first, second, and third organic electro-luminescence unit is disposed in corresponding pixel area. Each first, second, and third organic electro-luminescence unit is electrically connected with one of the data lines and scan lines correspondingly. Each source driver is disposed at one side of the substrate. The data lines electrically connected with the first, second and third organic electro-luminescence units are electrically connected with corresponding source drivers. The gate driver is disposed at another side of the substrate and electrically connected with the scan lines. The luminous efficiency can be enhanced.

Organic electro-luminescence display apparatus

A digital-to-analog data converter for converting a digital input signal to an analog output signal is provided. The digital-to-analog data converter includes a register, a decoder, a converting unit and an output unit. During a first period, the decoder decodes least significant bits, and takes the decoded least significant bits as a first control signal for controlling the converting unit to output a first converting current according to the first control signal. During a second period, the decoder decodes most significant bits, and takes the decoded most significant bits as a second control signal for controlling the converting unit to output a second converting current according to the second control signal. The output unit registers the first converting current during the first period, amplifying the second converting current, and combining the amplified second converting current with the registered first converting current as the analog output signal during the second period.

Growing community of inventors

Taoyuan County, Taiwan

I-Cheng Shih