Lg Electronics Inc.

Samsung Display Co., Ltd.

Samsung Electronics Co., Ltd.

Hyundai Motor Company

Kia Motors Corporation

Thinkware Corporation

Industry-university Cooperation Foundation Hanyang University

Semes Co., Ltd.

Amorepacific Corporation

Samsung Displayco., Ltd.

Hyunwoo Lee

Seunghee Han

Jinmin Kim

Jaehoon Chung

Hyeyoung Choi

Hyukmin Son

Hyunsoo Ko

Hangyu Cho

Moonil Lee

Dongcheol Kim

Sungho Moon

Jiwoong Jang

Youngwook Kim

Sangkyung Lee

Suckchel Yang

Mingyu Kim

Sangmin Kim

Kang-Woo Lee

Jinsoo Choi

Dongguk Lim

Jaekook Ha

Sehun Kim

Yoon Ho Jang

Eungdo Kim

Yongkyu Kang

Hyunjae Kang

Jinsam Kwak

Yeong Hyeon Kwon

Jin Sam Kwak

Dong Cheol Kim

Jinyoung Chun

Wookbong Lee

Jungsik Park

Minji Kim

Hyunju Hong

Dongwoo Shin

Minseok Noh

Donghoon Kim

Wonseok Joo

Dukki Kim

Sunghyup Lee

Juhwa Ha

Yong-Jin Kim

Jooyoung Kim

Youngwoo Park

Junhyuk Park

Nok Hyun Park

Ji Eun Jang

Jongwon Park

Sung Phil Ryu

Sungmin Lee

Yongjun Ahn

Chuljun Park

Jeonghun Lim

Jun-Hee Lee

Taeyoung Park

Jungseon Park

Sunhee Oh

Yeonghyeon Kwon

Eunju Nam

Seunguk Noh

Ginam Park

Junhyuk Chang

Jaesung Byun

Kyu-Hun Shim

Jaesuk Yoo

Seung-Hyuck Heo

Se Jin Yoo

Chang Ho Jung

Sangheon Ye

Yong-Jun Ahn

Yu Jin Oh

Beomju Kim

Sera Park

Hyo-Jin Bae

Min-Young Chang

Byungchan Kim

Chunghui Lee

Kiseob Hong

Donghoon Jung

Daehoon Song

Juhwan Kim

Junkyoung Lee

Raetaek Oh

Mira Park

Sojung Park

Jongho Shin

Jaehee Cho

Seunghwan Roh

Kyoungwon Seo

Hyungsoon Kim

Dusik Bae

Jaesung Lim

Haeyoung Kwon

Sanga Bang

Min Kyun Lee

Jeongjae Bang

Jiyoung Lee

Jihyo Kim

An apparatus for manufacturing a display device includes: a display panel comprising a display area, an adjacent area surrounding the display area, and a bending area extending from one side of the adjacent area; a stage on which the display panel is located; a first applicator configured to discharge a first material to the bending area of the display panel; and a second applicator configured to discharge a second material to the adjacent area of the display panel, the second material being different from the first material, wherein a position of at least one of the first applicator or the second applicator is changeable in a first direction.

Apparatus for manufacturing display device and method of manufacturing display device

A substrate transfer system and method includes a mobile robot configured to handle a substrate carrier and comprising a power receiver; a mobile robot interface device configured to handle the substrate carrier and comprising a power feeder configured to supply an electromotive force to the power receiver of the mobile robot; at least one of: a first actuator configured to move the power feeder to adjust a distance between the power feeder and the power receiver and a second actuator configured to move the power receiver to adjust a distance between the power feeder and the power receiver; an identification tag disposed on any one of the mobile robot and the mobile robot interface device; a tag reader configured to recognize the identification tag; and a controller configured to control an operation of the mobile robot and to control an operation of the first and/or second actuator and the controller is further configured to control the first and/or second actuator to adjust the distance between the power feeder and the power receiver.

Substrate transfer system and method with charging function

An electronic device includes memory storing instructions, a radar configured to transmit an electromagnetic signal and receive a radar signal which is a reflected signal of the electromagnetic signal, the reflected signal being reflected from at least one target object, a touch pad configured to detect a touch of a user based on a designated touch threshold value, and at least one processor operatively coupled with the memory, the radar, and the touch pad. The instructions may, when executed by the at least one processor, cause the electronic device to: obtain the radar signal received by the radar; identify, based on the radar signal, a surrounding environment of the electronic device, and adjust the touch threshold value based on the surrounding environment.

Electronic device for controlling touch sensitivity based on radar and method of operating same

According to an embodiment, a cassette storage case includes a body defining an internal storage space for a cassette. The body includes a lower body part, and a shield body part extending upward from an upper surface outer region of the lower body part. The shield body part has an opening in an upper portion thereof. A load protruding portion extends outward from an outer bottom surface of the lower body part, and has a shape that corresponds to a shape of the opening.

Cassette storage case and cassette management system including the same

A transfer apparatus according to the disclosure includes a mast portion including a base portion, and a protrusion portion protruding from the base portion, and a plurality of shuttles configured to move along the mast portion, thereby transferring a carrier. The mast portion includes a first magnet track fixed to a first sidewall of the protrusion portion, and a second magnet track fixed to a second sidewall of the protrusion portion. Each of the plurality of shuttles includes a first coil portion adjacent to the first magnet track in a horizontal direction, and a second coil portion adjacent to the second magnet track in the horizontal direction. The protrusion portion, the first magnet track, and the second magnet track are disposed between the first and second coil portions.

Parallel transfer apparatus

An electronic device includes a housing, a first substrate disposed in an internal space of the housing, a conductive structure disposed at a location isolated from the first substrate, a second substrate electrically connected to the conductive structure and the first substrate, and an electrical connection member electrically connecting the second substrate to the conductive structure. The electrical connection member may include a first fixing portion fixed to the conductive structure, a second fixing portion fixed to the second substrate, and a connection portion connecting the first fixing portion and the second fixing portion. The first fixing portion includes a first bent portion bent along a first bent line from a neck portion, that is, a boundary area with the connection portion, and a second bent portion bent along a second bent line from the first bent portion. The first bent portion is bent in a first direction becoming distant from the conductive structure, and the second bent portion is bent in a second direction opposite to the first direction.

Electronic device including electrical connection member

A method is provided for transmitting Acknowledgement/Negative Acknowledgement (ACK/NACK) information in a wireless communication system. A User Equipment (UE) configures a Physical Uplink Control Channel (PUCCH) format 3 for transmission of the ACK/NACK information. The UE transmits the ACK/NACK information for downlink transmission in a downlink subframe set including M downlink subframes in one uplink subframe, wherein M>1. A plurality of serving cells are configured for the UE and include one Primary Cell (PCell) and at least one Secondary Cell (SCell). The UE transmits the ACK/NACK information using a PUCCH format 1b when a first condition is met that comprises a condition in case where the ACK/NACK information corresponds to one Physical Downlink Shared Channel (PDSCH) without a corresponding Physical Downlink Control Channel (PDCCH) received only on the PCell in the downlink subframe set and the ACK/NACK information corresponds to an additional PDSCH indicated by detection of one corresponding PDCCH.

Method and device for transmitting/receiving uplink control information in wireless communication system

A bonding device includes a stage supporting a display panel including a first area through which a pad is exposed, a sensor disposed on the stage and facing the first area, and a handler disposing a circuit board on the first area. The handler includes a body supporting the circuit board and a rod connected to the body and selectively in contact with a second area of the circuit board overlapping the first area.

Bonding device

An organic light-emitting device includes a first hole transport region including a polymer compound that includes a repeating unit derived from a compound including a moiety represented by Formula 1A and a second hole transport region including a first compound and a second compound, the first compound including a repeating unit represented by Formula 1, the second compound being a compound represented by Formula 1, and the third compound being a compound represented by Formula 3.

Organic light-emitting device and method of manufacturing the same

A detection device includes a transfer device to travel along a rail while gripping a carrier, and a detection structure mounted on the carrier. The detection structure includes a collector to suck in air, a detector connected to the collector, the detector including a plurality of sensors, a plurality of sensor control boards receiving electrical signals from the plurality of sensors, the plurality of sensor control boards generating, based on the electrical signals, type data and concentration data regarding pollutants included in the air sucked in by the collector, and a communication control board connected to the plurality of sensor control boards.

Pollutant detection devices and monitoring system having the same

A wafer storage system includes a main rail, an overhead hoist transport (OHT) on the main rail, the OHT being configured to transfer at least one storage case with wafers, an interface port on at least one side of the main rail, an auxiliary rail on one side of the interface port, the auxiliary rail being parallel to the main rail, and the interface port being between the main rail and the auxiliary rail, an auxiliary transport on the auxiliary rail, the auxiliary transport being configured to move along the auxiliary rail and to move the at least one storage case, a storage shelf on at least one side of the auxiliary transport, the storage shelf being configured to store the at least one storage case, and a worktable on one side of the storage shelf, the storage shelf being between the worktable and the auxiliary transport.

Wafer storage system

A transfer apparatus includes a lower plate including a lower link arm and a lower support, the lower support being fixed to an upper surface of the lower plate, an upper plate on the lower plate and configured to support a wafer stacking box on an upper surface of the upper plate, the upper plate including an upper link arm, and an upper support that is fixed to the upper surface of the upper plate, and a fixing member that is connected to the upper link arm, the fixing member configured to selectively contact the wafer stacking box. The upper plate is aligned with the lower plate in a first horizontal direction, and is configured to perform linear movement on the lower plate in the first horizontal direction.

Transfer apparatus having link arms and stockers having the same

A method of fabricating a display device may include disposing a display panel on a stage to be parallel to an XZ-plane defined by a horizontal X-axis and a vertical Z-axis, measuring a height of a first side surface of the display panel in a direction of the Z-axis, rotating the stage such that the first side surface is parallel to a reference horizontal line in case that a result of the measured height indicates that the first side surface includes an inclined surface, moving the display panel in a direction of the Z-axis such that a first pad disposed on the first side surface overlaps the reference horizontal line, and bonding a second pad of a printed circuit board with the first pad.

Bonding apparatus and method of fabricating display device using the same

The present invention relates to a wireless communication system. More specifically, the present invention relates to a method and a device for reporting CSI in a wireless communication system, the method comprising: a step for configuring a plurality of serving cells; and a step for reporting the CSI of only one serving cell in a corresponding subframe, wherein the step for reporting the CSI of only one serving cell comprises: excluding reporting the CSI of a lower priority when CSI reports of the plurality of serving cells in the corresponding subframe collide; and excluding reporting the CSI of serving cells other than the serving cell having the smallest index when the CSI reports of different serving cells having the same priority in the corresponding subframe collide.

Method and device for transmitting control information in wireless communication system

A method is provided for transmitting Acknowledgement/Negative Acknowledgement (ACK/NACK) information in a wireless communication system. A User Equipment (UE) configures a Physical Uplink Control Channel (PUCCH) format 3 for transmission of the ACK/NACK information. The UE transmits the ACK/NACK information for downlink transmission in a downlink subframe set including M downlink subframes in one uplink subframe, wherein M&#x3e;1. A plurality of serving cells are configured for the UE and include one Primary Cell (PCell) and at least one Secondary Cell (SCell). The UE transmits the ACK/NACK information using a PUCCH format 1b when a first condition is met that comprises a condition in case where the ACK/NACK information corresponds to one Physical Downlink Shared Channel (PDSCH) without a corresponding Physical Downlink Control Channel (PDCCH) received only on the PCell in the downlink subframe set and the ACK/NACK information corresponds to an additional PDSCH indicated by detection of one corresponding PDCCH.

Growing community of inventors

Anyang-si, South Korea

Hyunwoo Lee