Lg Electronics Inc.

Electronics and Telecommunications Research Institute

Korea Institute of Science and Technology

Lg Chem, Ltd

Hyunwoo Cho

Bongchu Shim

Geunhyung Lee

Junghoon Kim

Changseo Park

Woocheol Kang

Jongmin Lee

Wonjae Chang

Hyeyoung Yang

Dohee Kim

Kwangsoo Jung

Jisoo Ko

Minjae Jeong

Junghyun Cho

Ig Jae Kim

Je Soo Ko

Seungyoun Kim

Byoungkwon Cho

Kiseong Jeon

Mihee Heo

Jongryul Kim

Haesol Park

Sang-Soo Lee

Sang-Kyu Lim

Heuk Park

Jong-Yoon Shin

Je-Soo Ko

Gunho Kim

Jideok Kim

Ki Ho Han

Sae Kyoung Kang

Juchan Choi

Yongil Shin

Gwinan Hwang

Wangjoo Lee

Joo-Hwan Sung

Seongmin Moon

Dongmyung Kim

Yonggap Park

Seulbitna Lee

Se-Hoon Baek

Eui Kwang Jeong

The present invention may be applied to display device-related technical fields and relates to a display device using a semiconductor light-emitting element, such as a micro light-emitting diode (LED), and a manufacturing method therefor. The present invention, according to one embodiment, may comprise: a substrate; a stepped film positioned on at least some pixel regions, among a plurality of individual pixel regions positioned on the substrate; an assembly electrode positioned on the substrate or the stepped film; an insulation layer positioned on the assembly electrode; a partition wall positioned on the insulation layer and defining an assembly groove having mounted therein a semiconductor light-emitting element forming the individual pixel; the semiconductor light-emitting element mounted in an assembly surface of the assembly groove; and a lighting electrode electrically connected to the semiconductor light-emitting element.

Display device using semiconductor light-emitting element and manufacturing method therefor

Provided in the present specification are a substrate structure having an exclusive design for allowing assembly on a substrate, at the same time, of a plurality of semiconductor light emitting devices having various colors, and a new type of semiconductor light emitting device, such that the semiconductor light emitting devices can be quickly and accurately assembled on the substrate with a concern about color mixing. Here, at least one of the plurality of semiconductor light emitting devices, according to one embodiment of the present invention, comprises a bump part located in the lateral direction of a surface to be assembled. An assembly groove in which the semiconductor light emitting device including the bump part is assembled is provided with a protrusion part facing toward the inside of the assembly groove.

Display device using micro LED having outward protrusion for assembly and manufacturing method therefor

The present invention relates to a display device having a structure in which an assembly substrate on which self-assembly has taken place can be used as a final substrate, and a method for manufacturing same. According to an embodiment of the present invention, first-conductive-type electrodes of vertical-type semiconductor light-emitting elements can be connected to seed metal, which is used as a wiring electrode, via a solder part, and thus there is the effect of directly using, as a final substrate, an assembly substrate on which the vertical-type semiconductor light-emitting elements are self-assembled, without an additional transfer process.

Display device using semiconductor light-emitting elements and manufacturing method therefor

The present invention provides an assembly substrate used in a method for manufacturing a display device which mounts semiconductor light emitting devices on a predetermined position of an assembly substrate by using an electric field and a magnetic field. Specifically, the assembly substrate is characterized by comprising: a base part; a plurality of assembly electrodes formed extending in one direction and disposed on the base part; a dielectric layer laminated on the base part so as to cover the assembly electrodes; a partition wall formed on the base part and including a plurality of grooves for guiding the semiconductor light emitting devices to a predetermined position; and a metal shielding layer formed on the base part, wherein each of the plurality of grooves penetrates the partition wall so as to form a seating surface on which the guided light emitting devices are seated, and the metal shielding layer overlaps with a part of the seating surface such that an electric field formed on a part of the seating surface is shielded.

Method for manufacturing display device, and substrate for manufacturing display device

Discussed is a self-assembly apparatus of a semiconductor light emitting device, the self-assembly apparatus including a fluid chamber configured to accommodate a plurality of semiconductor light emitting devices, each semiconductor light emitting device having a magnetic body; a magnet disposed to be spaced apart from the fluid chamber and configured to apply a magnetic force to the plurality of semiconductor light emitting devices; and a position controller connected to the magnet, and configured to control a position of the magnet; and a power supply configured to induce formation of an electric field on a substrate placed at an assembly position so that the plurality of semiconductor light emitting devices are seated at preset positions on the substrate while being moved due to a positional change of the magnet, wherein the position controller transfers the magnet in one direction while rotating the magnet about a rotation axis for the magnet.

Self-assembly apparatus and method for semiconductor light emitting device

The embodiment relates to an intelligent integrated assembly and transfer apparatus. The intelligent integrated assembly and transfer apparatus according to the embodiment can include a fluid chamber, a roller unitand assembly inspection unit. The fluid chambercan accommodate semiconductor light emitting devices. Semiconductor light emitting devicescan be assembled on an assembly substrate. The assembly substratecan be mounted on the roller unit. The roller unitcan rotate the assembly substrate. The assembly inspection unitcan inspect the semiconductor light emitting devicesassembled on the assembly substrate. The roller unitcan include a roller rotated partwhere the assembly substrateis mounted and rotated, a roller driving partfor rotating the roller rotated part, and a magnet head unitfor applying magnetic force to the semiconductor light emitting devicesto be assembled on the assembly substrate

Intelligent integrated assembly and transfer apparatus for semiconductor light emitting device

Discussed is an apparatus for self-assembling semiconductor light-emitting devices, the apparatus including a fluid chamber to accommodate the semiconductor light-emitting devices, each semiconductor light-emitting device having a magnetic body; a magnet to apply a magnetic force to the semiconductor light-emitting devices while an assembly substrate is disposed at an assembly position of the self-assembly apparatus; a power supply to induce formation of an electric field on the assembly substrate to allow the semiconductor light-emitting devices to be seated at a preset positions on the assembly substrate in a process of moving the semiconductor light-emitting devices due to a change in a position of the magnet; and a fluid injector to shoot a fluid to some of the semiconductor light-emitting devices to allow the some of the semiconductor light-emitting devices seated on the assembly substrate to be separated from the assembly substrate.

Apparatus and method for self-assembling semiconductor light-emitting device

Embodiments relate to a method for supporting X-ray image reading including receiving information associated with a reading target positioned in a reading space where X-rays pass through or are reflected off, acquiring a non X-RAY image of an item object based on the information associated with the reading target, and generating a fake X-RAY image of the item object by applying the non X-RAY image of the item object to the image transform model, and a system for performing the same.

Method for supporting X-RAY image reading using image transform model and system performing the same

A display device includes a plurality of semiconductor light emitting diodes, first and second electrodes respectively extending from the plurality of semiconductor light emitting diodes to supply an electrical signal to the plurality of semiconductor light emitting diodes, a plurality of pair electrodes disposed on a substrate and having a first electrode and a second electrode, a dielectric layer disposed on the plurality of pair electrodes, and a chemical bond layer disposed between the dielectric layer and the plurality of semiconductor light emitting diodes and forming a covalent bond with the dielectric layer and each of the plurality of semiconductor light emitting diodes. The chemical bond layer bonds the semiconductor light emitting diodes to the dielectric layer when a voltage applied to the plurality of pair electrodes is cut off after the plurality of semiconductor light emitting diodes are assembled on the dielectric layer.

Display device and method for self-assembling semiconductor light emitting diodes

Disclosed are an X-RAY image reading support method including the steps of acquiring a target X-RAY image photographed by transmitting or reflecting X-RAY in a reading space in which an object to be read is disposed; applying the target X-RAY image to a reading model that extracts features from an input image; and identifying the object to be read as an object corresponding to a classified class when the object to be read is classified as a set class based on a first feature set extracted from the target X-RAY image, and an X-RAY image reading support system performing the method.

System and method for supporting user to read X-RAY image

Discussed is an assembly apparatus for assembling a semiconductor light emitting diode to a display panel, the assembly apparatus including an assembly module including at least one magnetic member and a magnetic member accommodator having at least one magnetic member accommodation hole, and a rotary module connected to the assembly module to rotate the assembly module along an orbit.

Assembly apparatus for assembling semiconductor light emitting diode to display panel

An evaporator includes: an evaporator case that defines a food storage space therein; a cooling tube located at the evaporator case and filled with refrigerant; a foil heater attached to at least one surface of the evaporator case and configured to contact the evaporator case and to generate heat such that heat for defrosting is transferred to the evaporator case. A defrosting time is reduced in comparison to that of conventional natural defrosting, such that the freshness of food can be maintained, and the cooling efficiency, having been reduced by frost, is increased such that power consumption can be reduced. The foil heater is attached to a conventional roll-bond type evaporator case, and the present invention has an advantageous effect of facilitating the maintenance of the foil heater because of a structure in which the foil heater is attached to the evaporator case.

Evaporator and refrigerator having same

A display device can include a plurality of semiconductor light emitting diodes; first and second wiring electrodes respectively extending from the plurality of semiconductor light emitting diodes to supply an electrical signal to the plurality of semiconductor light emitting diodes; a plurality of pair electrodes disposed on a substrate and having a first electrode and a second electrode that generate an electric field when a current is supplied thereto; a dielectric layer disposed to cover the plurality of pair electrodes; and a covalent bond layer disposed between the dielectric layer and the plurality of semiconductor light emitting diodes, and forming a covalent bond with the dielectric layer and each of the plurality of semiconductor light emitting diodes, wherein the first wiring electrode and the second wiring electrode are located at opposite sides of the plurality of pair electrodes based on the plurality of semiconductor light emitting diodes.

Disclosed is an evaporator, comprising: a heating tube left as an empty space between first and second case sheets, which form an evaporator case, so as not to be overlapped with a cooling tube, and forming a heating passage in which a working liquid for defrosting flows; and a heater attached to the outer surface, which corresponds to the heating tube, of the evaporator case so as to heat the working liquid inside the heating tube. The heating tube can have a structure which an inlet and an outlet are respectively formed at both sides of a heater attachment part in the longitudinal direction and both end portions of a passage part are respectively connected to the inlet and the outlet, or can have a structure in which an opening is formed at one side of the heater attachment part, the working liquid heated by the heater is discharged through the opening, and the cooled working liquid is returned. The structures can form the heating passage, enabling the working liquid to circulate therethrough, without forming the inlet and the outlet, which are respectively connected to both end portions of the passage part, to be parallel at one side of the heater attachment part.

A defrosting device includes a heating unit filled with a working fluid and including an active heating part heated to a first temperature that can evaporate the working fluid, and a passive heating part positioned at a rear side of the active heating part and heated to a lower temperature than the first temperature. The defrosting device also includes a heat pipe disposed adjacent to an evaporator to transfer heat to the evaporator while circulating working fluid heated by the active heating part, the heat pipe including an entrance portion configured to receive working fluid evaporated by the active heating part, and a return portion connected adjacent to the passive heating part and configured to receive working fluid that has condensed after circulating through the heat pipe. Condensed working fluid received at the heating unit first passes through the passive heating part before being reheated at the active heating part.

Growing community of inventors

Seoul, South Korea

Hyunwoo Cho