Samsung Electronics Co., Ltd.

Hyunsu Sim

Junho Yoon

Byungmoon Bae

Junggeun Shin

Dongjin Lee

Jungchul Lee

Heejae Nam

Hwayoung Lee

A semiconductor substrate may include a plurality of semiconductor chips and a protection pattern. The semiconductor chips may be divided by two scribe lanes intersecting each other. Corners of the semiconductor chips may be disposed at the intersection of the two scribe lanes. The protection pattern may be arranged at the intersection of the scribe lanes to surround the corners of the semiconductor chips. Thus, the corners of the semiconductor chips may be protected by the protection pattern form colliding with each other in a following grinding process.

Semiconductor substrate and method of sawing the same

According to an embodiment of inventive concepts, a substrate dicing method may include forming reformed patterns in a substrate using a laser beam, grinding a bottom surface of the substrate to thin the substrate, and expanding the substrate to divide the substrate into a plurality of semiconductor chips. The forming of the reformed patterns may include forming a first reformed pattern in the substrate and providing an edge focused beam to a region crossing the first reformed pattern to form a second reformed pattern in contact with the first reformed pattern.

Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them

Growing community of inventors

Cheonan-si, South Korea

Hyunsu Sim