Microchip Technology Inc.

Hyunsoo Yeom

Ajay Kumar

Cheng Xu

John L House

Qing Li

Systems, methods and devices relate to remote temperature sensing responsive to fractional currents used to bias a remote temperature diode. Fractional currents may be selected to simplify at least some temperature calculations performed using digital logic. Values of at least two voltage changes may be determined at least partially based on values of voltages generated across a pair of nodes at least partially responsive to excitation currents. Such pair of nodes associated with sensing paths coupled with a remote diode. A value of temperature may be determined at least partially based on the values of at least two voltage changes and a stored value of a fractional mirror ratio. The fractional mirror ratio represents a relationship between current magnitudes of excitation currents.

Fractional mirror ratio technique for digital remote temperature sensors, and related systems, methods, and devices

Methods, systems and devices of the present disclosure involve techniques for cancelling base resistance error otherwise present in remote temperature sensors such as remote diode temperature sensors. In one or more embodiments, measurement logic configured to determine a temperature of or near a remote temperature sensor may be configured to determine an error cancelling coefficient and to calculate a temperature value, at least in part, responsive to the error cancelling coefficient. In some cases, error cancelling coefficients may be determined using one or more calibration techniques.

Base resistance cancellation method and related methods, systems, and devices

Systems, methods and devices are described related to remote temperature sensing. In one embodiment, fractional currents are used to bias a remote temperature diode. Such fractional currents may be selected to simplify at least some temperature calculations performed using digital logic.

Methods of making a semiconductor device packages may involve placing a metal material at least partially around a region of integrated circuitry embedded within an active surface of a semiconductor die, the metal material located on the active surface. At least a portion of the metal material may be left electrically disconnected from the region of integrated circuitry. The semiconductor die and the metal material may be encapsulated in an encapsulant material, the encapsulant material extending to a height above the active surface higher than a maximum height of the metal material above the active surface.

Methods of reinforcing integrated circuitry of semiconductor devices and related semiconductor devices and packages

Embodiments of the present disclosure include a microcontroller with a frequency test circuit, a device-under-test (DUT) input, and a calculation engine circuit. The calculation engine circuit is configured to compare a measured frequency from the frequency test circuit measured from the DUT input to a reference frequency stored in memory, and, based on the comparison, adjust frequency of the DUT generating the DUT input.

Systems and methods for storing frequency information for system calibration/trimming

A crystal oscillator is coupled to a digital automatic gain control (AGC) having oscillation detection and amplitude control loops. The oscillation detection loop may increase the transconductance (gm) of the oscillator transistor until oscillation is detected therefrom. Then the amplitude control loop detects the amplitudes of oscillations from the crystal oscillator, compares these amplitudes to high and low voltage references and generates digital signals to find a critical transconductance (gm) for an oscillator amplifier and control this gm to maintain a constant oscillation waveform amplitude therefrom. An up/down counter defines the servo control loop bandwidth/update-rate according to an update clock rate thereto. Loop stability is achieved when the control loop bandwidth is less than the start-up time required for the oscillation envelope of the crystal oscillator to grow for oscillation. An oscillator failure detector may also be provided.

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Chandler, AZ, United States of America

Hyunsoo Yeom