Samsung Electronics Co., Ltd.

Hyunkyu Kim

Jongbo Shim

Kyoungsei Choi

Ji Hwang Kim

Eunhee Jung

Jihwang Kim

Jeongmin Kang

A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.

Semiconductor package including an interposer and method of fabricating the same

A semiconductor package is provided including a package substrate. The package substrate includes a substrate pattern and a substrate insulation layer at least partially surrounding the substrate pattern. The package substrate has a groove. An external connection terminal is disposed below the package substrate. An embedded semiconductor device is disposed within the groove of the package substrate. The embedded semiconductor device includes a first substrate. A first active layer is disposed on the first substrate. A first chip pad is disposed on the first active layer. A buried insulation layer is disposed within the groove of the package substrate and at least partially surrounds at least a portion of a lateral surface of the embedded semiconductor device. A mounted semiconductor device is disposed on the package substrate and is connected to the package substrate and the embedded semiconductor device.

Semiconductor package including an embedded semiconductor device

Semiconductor package including an in interposer and method of fabricating the same

Growing community of inventors

Yongin-si, South Korea

Hyunkyu Kim