Samsung Electronics Co., Ltd.

Hyunjin Lee

Ilyoung Han

Juhyung Lee

Kyoungwhan Oh

Minwoo Rhee

Minjae Shin

Kyoungran Kim

Sunwoo Park

Geunsik Oh

Chulhyun Park

Jungwoo Cho

Nungpyo Hong

Soonwon Lee

Seungdon Lee

Sujie Kang

Jungshin Lee

A 3D printing apparatus includes a substrate stage configured to support a substrate, a droplet ejector including at least one droplet nozzle configured to discharge a photo-curable droplet on the substrate, a first photo curing unit configured to irradiate light to a drop path along which the droplet discharged from the droplet nozzle falls to change a viscosity of the droplet, and a second photo curing unit configured to irradiate light onto the droplet that has landed on the substrate to cure the droplet.

3D printing apparatus and 3D printing method

A substrate debonding apparatus configured to separate a support substrate attached to a first surface of a device substrate by an adhesive layer, the substrate debonding apparatus including a substrate chuck configured to support a second surface of the device substrate, the second surface being opposite to the first surface of the device substrate; a light irradiator configured to irradiate light to an inside of the adhesive layer; and a mask between the substrate chuck and the light irradiator, the mask including an opening through which an upper portion of the support substrate is exposed, and a first cooling passage or a second cooling passage, the first cooling passage being configured to provide a path in which a coolant is flowable, the second cooling passage being configured to provide a path in which air is flowable and to provide part of the air to a central portion of the opening.

Substrate debonding apparatus

Growing community of inventors

Hwaseong-si, South Korea

Hyunjin Lee