Dupont Specialty Materials Korea Ltd.

Dupont Toray Specialty Materials Kabushiki Kaisha

Hyunji Kang

Akihiko Kobayashi

Shunya Takeuchi

Sawako Horie

Kasumi Takeuchi

Misoon Jung

Curable silicone compositions, encapsulants including the same, and optical semiconductor devices including the encapsulants are provided herein. In an embodiment, a curable silicone composition includes: (A) an alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) an epoxy group-containing resinous organopolysiloxane represented by Average Unit Formula (I): (RSiO)(RSiO)(RSiO)(SiO)(XO)wherein Rare independently halogen-substituted or unsubstituted monovalent hydrocarbon groups, at least two Rare alkenyl groups; Rare independently halogen-substituted or unsubstituted monovalent hydrocarbon groups or epoxy group-containing organic groups, wherein at least one Ris an epoxy group-containing organic group; X is a hydrogen atom or an alkyl group; 0≤f<1; 0<g<1; 0≤h<0.9; 0≤i<0.5; and 0<j<0.5; f+g+h+i+j=1.0; h+i>0; and j/(f+g+h+i+j)>0.05 and (D) a curing catalyst.

Curable silicone composition, encapsulant and optical semiconductor device

A curable silicone composition comprises (A) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (SiO4/2) unit, (B) a resinous organohydrogenpolysiloxane including at least two silicon atom-bonded hydrogen atoms per molecule and at least one (SiO4/2) unit, (C) a catalyst for hydrosilylation reaction, and (D) a curing reaction inhibitor. The curable silicone composition exhibits practically effective curability even at low temperatures, has a low shape deformation and shrinkage rate during curing, can be cured in a short period of time, and can form a transparent and high-hardness cured product.

Growing community of inventors

Gyeonggi-Do, South Korea

Hyunji Kang