University of Illinois

Other

Hyungsoo Choi

Kyekyoon Kim

Young Bin Choy

Ju Gao

Philip Edward Heil

Ravindra Pratap Singh

Provided is a microcapsule for increasing the survival and/or function of a cell, such as an islet cell, microcapsule can include an outer shell comprising a first polymer; an interior core comprising: at least one live cell; a second polymer; and at least one microsphere comprising a third polymer and a compound capable of improving survival of the at least one cell. The improved survival and/or function of the at least one live cell in the microcapsule is compared to a live cell in a microcapsule in the absence of the compound capable of improving survival of the at least one cell. The first and second polymer may include alginate and the third polymer (used for the microsphere) may comprise PLGA. The compound may include a GLP-1 receptor agonist. Also provided are methods for producing such microcapsules; insulin delivery systems using the microcapsules, and methods to treat disease, such as diabetes, using the microcapsules.

Capsules with intracapsular microspheres for improved survival and function of encapsulated cells

A system that incorporates teachings of the present disclosure may include, for example, a method for applying a force to at least one of an inner stream, an outer stream or both of a combined stream to produce a plurality of capsules, receiving image data, processing the image data, detecting undesirable capsules from the processed image data, applying a bias charge only to the detected undesirable capsules, and segregating the biased undesirable capsules from the unbiased desirable capsules. Additional embodiments are disclosed.

Encapsulated materials and methods for encapsulating materials

The subject disclosure provides a method for applying dissimilar electrical charges to portions of a plurality of applicators by way of a conductor included in a conduit of each applicator. The method further includes causing each applicator to generate one or more jet sprays of a liquid received by each applicator for application of a material on a substrate, where one or more portions of the material on the substrate have one or more net charges associated with the dissimilar electrical charges applied to the portions of the plurality of applicators, where the conductor of each applicator is a sleeve positioned in the applicator, and where a diameter of the sleeve results in one of an outer surface of the sleeve contacting a surface of the conduit, or the outer surface of the sleeve having a separation from the surface of the conduit of the applicator. Additional embodiments are disclosed.

Apparatus and method for applying a film on a substrate

A high intensity discharge arc lamp comprises an arc tube, a metal halide in the arc tube, and a coating on the arc tube. The coating comprises a UV absorbent material.

High intensity discharge ARC lamp using UV-absorbant coating

A method of forming particles, comprises accelerating a first stream comprising a first liquid, applying a charging voltage of at most 1.5 kV to the first stream, and vibrating the first stream, to form particles.

Microparticles

A system that incorporates teachings of the present disclosure may include, for example, an apparatus having a tube with an ingress opening to receive a liquid, and an egress opening to release the liquid, a conductor positioned in a conduit of the tube, the conductor and the conduit having dimensions to cause a surface tension of the liquid to prevent a constant flow of the liquid from the egress opening, and a power supply coupled to the conductor to apply a charge to the liquid to overcome the surface tension and form at the egress opening a single jet stream of the liquid applicable on a substrate to create a pattern. The single jet stream can be controllable in part by a viscosity of the liquid. Additional embodiments are disclosed.

Apparatuses and methods for applying one or more materials on one or more substrates

A system that incorporates teachings of the present disclosure may include, for example, an apparatus having an outer nozzle operable to discharge an outer stream of a shell solution, and an inner nozzle operable to discharge an inner stream of a core solution intermixed with a plurality of materials. The outer stream can substantially surrounds the inner stream, thereby forming a combined stream. A plurality of capsules can be formed responsive to a force applied to the combined stream. At least a portion of the plurality of capsules are desirable capsules, each having a core encapsulated by a portion of the shell solution. The core can have at least one of the plurality of materials encapsulated by a portion of the core solution without protruding an outer surface of the portion of the shell solution. Additional embodiments are disclosed.

One embodiment includes forming a nanowire on a substrate from an organometallic vapor. The nanowire is grown during this formation in a direction away from the substrate and is freestanding during growth. The nanowire has a first dimension of 500 nanometers or less and a second dimension extending from the substrate to a free end of the nanowire at least 10 times greater than the first dimension. In one form, the organometallic vapor includes copper, silver, or gold. Alternatively or additionally, the nanowire is of a monocrystalline structure.

Electron emission device incorporating free standing monocrystalline nanowires

A system that incorporates teachings of the present disclosure may include, for example, an apparatus having a plurality of applicators, each applicator with an ingress opening to receive a liquid, and an egress opening to release the liquid, and a conductor positioned in a conduit of each of the plurality of applicators, the conductor and the conduit having dimensions to cause a surface tension of the liquid to prevent a constant flow of the liquid from the egress opening. Each conductor of the plurality of applicators can be coupled to one of one or more power sources operable to apply a charge to the liquid to overcome the surface tension and form at the egress opening of each applicator a plurality of jet sprays of the liquid applicable on a substrate to form a thin film. Additional embodiments are disclosed.

Disclosed are organometallic compounds derived from Groups VIIb, VIII, IX, and X metals useful as precursors for the formation of metal containing powders and for the chemical deposition of the metals on substrates, particularly for the chemical vapor deposition of metal films suitable for the manufacture of electronic devices. Methods for their use are also disclosed. The preferred organometallic compounds of the present invention are of the formula (R)M(PR), where M is a metal selected from the group consisting of manganese, technetium, rhenium, iron, cobalt, nickel, ruthenium, rhodium, palladium, osmium iridium and platinum wherein m is 0, 1, 2, 3 or 4; x is 2, 3, 4 or 5 and m+x are 2, 3, 4, 5, 6, 7 or 8, m and x selected according to each metals appropriate valence; each Ris independently selected from the group consisting of hydrogen, deuterium, N, H, Dand a variety of substituted alkyl groups; each Ris independently selected from the group consisting of lower alkyl, aryl, arylalkyl, and alkyl-Z, aryl-Z and arylalkyl-Z where Z is selected from the group consisting of oxy, silyl, siloxy, oxysilyl, siloxy, oxysiloxy, silyalkyl, oxysilylalkyl, siloxyalkyl, oxysiloxyalkyl, silylalkoxy, silylalkoxy, siloxyalkoxy and oxysiloxyalkoxy; and wherein when M is cobalt and one group Ris selected to be N, then m is 2 and the second group Ris hydrogen or deuterium.

Organometallic compounds and their use as precursors for forming films and powders of metal or metal derivatives

One embodiment includes noncatalytically forming a nanowire on a substrate from an organometallic vapor without application of any type of reduction agent. The nanowire is grown during this formation in a direction away from the substrate and is freestanding during growth. The nanowire has a first dimension of 500 nanometers or less and a second dimension extending from the substrate to a free end of the nanowire at least 10 times greater than the first dimension. In one form, the organometallic vapor includes copper and the nanowire essentially consists of elemental copper, a copper alloy, or oxide of copper. Alternatively or additionally, the nanowire is of a monocrystalline structure.

Nanostructures including a metal

Disclosed are organometallic compounds derived from Groups VIIb, VIII, IX, and X metals useful as precursors for the formation of metal containing powders and for the chemical deposition of the metals on substrates, particularly for the chemical vapor deposition of metal films suitable for the manufacture of electronic devices. Methods for their use are also disclosed. The preferred organometallic compounds of the present invention are of the formula (R ) M(PR ) , where M is a metal selected from the group consisting of manganese, technetium, rhenium, iron, cobalt, nickel, ruthenium, rhodium, palladium, osmium iridium and platinum wherein m is 0, 1, 2, 3 or 4; x is 2, 3, 4 or 5 and m&plus;x are 2, 3, 4, 5, 6, 7 or 8, m and x selected according to each metals appropriate valence; each R is independently selected from the group consisting of hydrogen, deuterium, N , H , D and a variety of substituted alkyl groups; each R is independently selected from the group consisting of lower alkyl, aryl, arylalkyl, and alkyl-Z, aryl-Z and arylalkyl-Z where Z is selected from the group consisting of oxy, silyl, siloxy, oxysilyl, siloxy, oxysiloxy, silyalkyl, oxysilylalkyl, siloxyalkyl, oxysiloxyalkyl, silylalkoxy, silylalkoxy, siloxyalkoxy and oxysiloxyalkoxy; and wherein when M is cobalt and one group R is selected to be N , then m is 2 and the second group R is hydrogen or deuterium.

The present invention provides a copper precursor according to the formula (R COOCR COR )Cu &lcub;L&rcub; , where x is 1, 2 or 3 and L is a neutral ligand. The precursors in the present invention, which are low melting solids or distillable liquids with high volatility and thermal stability, can be vaporized without decomposition and used to deposit high quality copper films. The improved stability of the copper compounds in the present invention enables them to reproducibly produce selective copper films on metallic or electrically conductive surfaces.

Growing community of inventors

Champaign, IL, United States of America

Hyungsoo Choi