Lam Research Corporation

Hyungjun Hur

Shantinath Ghongadi

Zhian He

Jingbin Feng

Cian Sweeney

Quan Ma

Quang Nguyen

Rezaul Karim

Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.

Controlling plating electrolyte concentration on an electrochemical plating apparatus

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Tigard, OR, United States of America

Hyungjun Hur