Samsung Electronics Co., Ltd.

Lg Electronics Inc.

Sk Innovation Co., Ltd.

Hyungjoon Kim

Taeho Kim

Jonghoon Park

Yangsoo Lee

Heejun You

Moonsu Chang

Teain An

Seulhan Park

Jinho Hyeon

Yongcheol Sa

Junseong Park

Myoungwoon Kim

Hee Jong Jeong

Seunghwan Kim

Sungeun Lee

Donghwi Kim

Jiwoon Im

Sangmin Kang

Daehyoung Kim

Il-Woo Kim

Junghwan Yeom

WooJin Jang

Jaewon Jung

Jinsuk Jang

Shanshan Jin

Siyoung Jang

Hyoungsun Park

Je-Dong Lee

Younghoon Kwon

A method of fabricating an integrated circuit device includes forming on a semiconductor substrate a mold stack that includes a plurality of insulating layers and a plurality of mold layers alternately arranged. A mask pattern including an opening is formed on the mold stack. A channel hole is formed by removing the mold stack exposed through the opening. A sacrificial film is formed on a lateral wall of the mold stack exposed through the channel hole. An oxidation process is performed on the sacrificial film and the mold stack to convert the sacrificial film to a sacrificial oxide film. An etching process is performed to remove the sacrificial oxide film.

Method of fabricating integrated circuit device and method of fabricating electronic system having the same

A method and apparatus for processing biometric information in an electronic device including a processor that operates at a normal mode or at a secure mode, the method comprising, detecting a biometric input event from a biometric sensor module at normal mode, creating biometric data based on sensed data from the biometric sensor module at the secure mode, performing biometric registration or biometric authentication based on the created biometric data at the secure mode, and providing result information of biometric registration or biometric authentication at the normal mode.

Method and apparatus for processing biometric information in electronic device

A multi-air conditioner for heating/cooling operations, including at least one indoor unit for heating/cooling operations including an indoor heat exchanger; and an outdoor unit for heating/cooling operations including a compressor, an outdoor heat exchanger, and a switching unit configured to be disposed in a discharge side of the compressor to switch a flow of refrigerant. The outdoor unit includes a receiver that selectively stores refrigerant or oil according to a cooling or heating operation mode and provides the stored refrigerant or oil to the compressor. Accordingly, in the accumulator of the multi-air conditioner using the receiver, the receiver which is not used in the heating mode may be converted and used for oil storage, thereby preventing oil burnout without adding structure.

Multi-air conditioner for heating and cooling operations

An air conditioning apparatus includes a heat exchange device that connects an outdoor unit to an indoor unit and that includes a heat exchanger configured to perform heat exchange between refrigerant and water. The heat exchanger reduces an amount of refrigerant used to perform a cooling operation or a heating operation.

Air conditioning apparatus

Disclosed is an electronic device which performs wireless communication and includes a first antenna configured to transmit and receive a signal in a first frequency band, a conductive member disposed to be spaced from the first antenna as much as a first distance, a printed circuit board disposed parallel to a first surface of the conductive member, and at least one conductive connection member interposed between the conductive member and the printed circuit board, wherein the conductive member is gap fed from the first antenna and operates as a radiator for wireless communication.

Electronic device including antenna

An electronic circuit includes a first filter and a second filter. The first filter passes a first frequency component of a first harmonic frequency generated by a first voltage source to form a potential difference in a chamber and a second frequency component of a second harmonic frequency higher than the first harmonic frequency. The second filter removes the first frequency component and the second frequency component received from the first filter. The second harmonic frequency is included in a first frequency band determined based on a capacitance of the second filter.

Electronic circuit for filtering signal received from plasma chamber

A radio frequency (RF) power monitoring device includes an RF sensor to monitor RF power transferred to a target load and an impedance of the target load and a transmission line to electrically connect the RF sensor to the target load and to transfer the RF power to the target load. A phase (&#x3c6;z) of the impedance of the target load is adjusted to satisfy a range of &#x2212;30&#xb0;+180&#xb0;*n&#x3c;&#x3c6;z&#x3c;30&#xb0;+180&#xb0;*n (where n=&#x2212;2, &#x2212;1, 0, 1, or 2).

Radio frequency (RF) power monitoring device and plasma enhanced (PE) system including the same

A method is provided that inputs/outputs security information to/from an electronic device. The security information inputting method includes sensing a motion for inputting security information by a sensor module; creating an interrupt according to the security information inputting motion; and reading the security information by a security information inputting module, in response to the interrupt.

Security information inputting/outputting method and electronic device adapted to the method

Provided are an apparatus and a method for estimating internal resistance of a battery pack. The apparatus includes: a voltage sensing unit that measures a voltage value of the battery pack; a current sensing unit that measures a current value of the battery pack; a temperature sensing unit that measures a temperature value of the battery pack; and a microprocessor unit (MCU) that calculates the internal resistance of the battery pack using values transferred from the voltage sensing unit, the current sensing unit, and the temperature sensing unit.

Apparatus and method for estimating internal resistance of battery

A method of forming an image sensor can be provided by forming a respective photoelectric conversion region in each of a plurality of unit pixel regions of a substrate and depositing a material configured to provide a negative fixed charge layer on the photoelectric conversion region.

Methods of forming image sensors including deposited negative fixed charge layers on photoelectric conversion regions

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Hwaseong-si, South Korea

Hyungjoon Kim